Parker Hannifin Corporation announced the launch of THERM-A-GAP PAD 30 and THERM-A-GAP PAD 60, the next generation of thermally conductive gap filler pads from Parker Chomerics.
With the performance of 3.2 W/m-K thermal conductivity, THERM-A-GAP PAD 30 reliably conforms to rough surface irregularities and air gaps on heat-generating components. For higher performance applications, THERM-A-GAP PAD 60 offers the enticing combination of both excellent thermal conductivity at 6.0 W/m-K, while being more than 40% softer than current like-performance thermal gap pads from Parker Chomerics.
Parker’s new thermal materials are manufactured globally and available in standard sheet sizes and thicknesses. They can easily be die-cut to custom dimensions and have various carrier and adhesive options for ease of use.
Learn more about the new THERM-A-GAP products at www.parker.com/chomerics.