Fujipoly recently released Sarcon GR130A, its newest high-performance, thermal gap filler pad. The highly conformable, gel-like sheets exhibit a thermal resistance as low as 0.02°C•in2/W at 43.5 PSI with thermal conductivity of 13 W/m°K.
Sarcon GR130A is available in five thicknesses (0.3, 0.5, 1.0, 1.5, and 2.0mm) up to a maximum dimension of 300mm x 200mm and can be die-cut to fit almost any application shape. This new Fujipoly® thermal interface material is well-suited for environments with operating temperatures ranging from -40 to +150°C.
When placed between high-power, heat-generating components, and a nearby heat sink, the silicone-based material completely fills air gaps between uneven components, board protrusions, and recessed areas. This maximizes heat transfer and dissipation, thereby improving overall performance.