A new integrated thin-film directional coupler is now available in a 2816 (7×4 mm) surface-mount package. This component is compatible with systems operating in the very-high-frequency (VHF) and ultra-high-frequency (UHF) bands. It is designed to support RF and microwave applications that require compact form factors, high reliability, and consistent electrical performance.
The device supports operation across the 225–750 MHz frequency range, with continuous power handling up to 20 W and a nominal impedance of 50 ohms. It maintains a voltage standing wave ratio (VSWR) 1.3 and provides -14 dB directivity. Several coupling options are offered across the operating band, including -10±1.2 dB, -10±2 dB, -15±2 dB, and -15±4 dB, depending on the version selected.
Insertion loss remains low across the operational spectrum, ranging from less than -0.8 dB to less than -0.9 dB. These performance characteristics are maintained across a wide operating temperature range of -40°C to +105°C. The component exhibits high repeatability across manufacturing lots and stable behavior under varying thermal and electrical loads, supporting consistent system-level RF performance.
The coupler includes nickel-based land grid array (LGA) terminations with a lead-free solder coating, allowing compatibility with various soldering processes, including reflow, wave, and vapor phase methods. It is packaged on tape and reel to facilitate automated assembly workflows. The part is RoHS compliant, manufactured under ISO 9001 standards, and suitable for use in designs adhering to IATF 16949 requirements.
This component’s target applications include high-frequency systems in telecommunications infrastructure, aerospace platforms, defense electronics, mobile radio units, radar systems, and RF testing environments. Its electrical and mechanical characteristics make it applicable where space constraints and high-frequency performance must be balanced.
