Navitas Semiconductor has announced the NV6169, a new high-power 650/800 V-rated GaNFast power IC with GaNSense technology to address higher-power applications such as 400-1000 W 4K/8K TVs and displays, next-generation gaming systems, 500 W solar microinverters, 1.2 kW data-center SMPS, and up to 4 kW / 5 hp motor drives.
GaN is a next-generation power semiconductor technology running 20x faster than traditional silicon. Compared with traditional silicon chargers, gallium nitride chargers can achieve 3x the power or 3x faster charge with up to 40% energy savings in just half the size and weight of legacy silicon solutions. GaNFast power ICs with GaNSense technology integrate power, drive, and control, with additional autonomous protection and loss-less current-sensing to deliver the simplest, smallest, fastest, and now even-higher-power performance.
The 45 mOhms NV6169 features a 36% reduction in on-resistance (RDS(ON)), delivering 50% more power than prior designs, in an industry-standard, low-profile, low-inductance, 8 x 8 mm PQFN package for high-efficiency, high-density power systems.
The NV6169 is the highest-power-rated IC from the most-advanced, third-generation integrated GaN platform. GaNFast power ICs with GaNSense technology feature GaN-industry-first features such as loss-less current sensing and the world’s fastest short-circuit protection, with a ‘detect-to-protect’ speed of only 30 ns, 6x faster than discrete solutions. In motor-drive applications, GaN ICs deliver up to 40% energy savings vs. silicon IGBTs, eliminate 30 external components, and increase system efficiency by 8%.
Unlike competing solutions, the NV6169 is rated at 650V for nominal operation plus an 800 V peak rating for robust operation during transient events. As a truly-integrated power IC, the GaN gate is fully-protected and the whole device is rated at an industry-leading electrostatic-discharge (ESD) specification of 2 kV.
The NV6169 is available immediately to customers under NDA. Mass production lead times are currently 6 to 16 weeks. Simulation models (PSPICE/LTSPICE/SiMetrix), a 3D package model (STP), and an application note (AN-0016) are available to designers to optimize next-generation systems.
