The International Electronics Manufacturing Initiative (iNEMI), with support from MEMS Industry Group (MIG), is planning a MEMS workshop immediately following the European Microelectronics and Packaging Conference (EMPC), September 15-16, in Brighton, England. The workshop, which is open to industry, will discuss the challenges of developing and adopting MEMS technologies plus set priorities and direction for future industry-led collaborative programs.
“MEMS devices are experiencing exponential growth,” said Bill Bader, CEO of iNEMI. “Their uses are quickly expanding from the traditional applications of relays, accelerometers and specialized sensors to a broadening array of applications in fluidics, RF components, medical and a growing number of automotive applications. Despite this growth, however, there are still several technology challenges to be addressed, everything from the need for new packaging technologies, to improved test and simulation capabilities, to a better understanding of the basic failure mechanisms.”
“Many of these technology needs, or gaps, are best addressed collaboratively by industry so that we can develop some common approaches and solutions for greater consistency and improved reliability, while continuing the drive for increased functionality on smaller, more highly integrated packages,” continued Bader. “With this workshop, we will begin the process of defining key collaborative efforts and setting priorities to address the most pressing needs.”
“As the trade association advancing MEMS across global markets, MIG is pleased to support iNEMI’s MEMS workshop,” said Karen Lightman, managing director of MIG. “MEMS is in the mainstream – therefore it is critical that the industry have forums such as this workshop, to address technology and manufacturing challenges to MEMS commercialization.”
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