• Skip to primary navigation
  • Skip to main content
  • Skip to primary sidebar
  • Skip to footer

Electrical Engineering News and Products

Electronics Engineering Resources, Articles, Forums, Tear Down Videos and Technical Electronics How-To's

  • Products / Components
    • Analog ICs
    • Battery Power
    • Connectors
    • Microcontrollers
    • Power Electronics
    • Sensors
    • Test and Measurement
    • Wire / Cable
  • Applications
    • 5G
    • Automotive/Transportation
    • EV Engineering
    • Industrial
    • IoT
    • Medical
    • Telecommunications
    • Wearables
    • Wireless
  • Learn
    • eBooks / Handbooks
    • EE Training Days
    • Tutorials
    • Learning Center
    • Tech Toolboxes
    • Webinars & Digital Events
  • Resources
    • White Papers
    • Educational Assets
    • Design Guide Library
    • Digital Issues
    • Engineering Diversity & Inclusion
    • LEAP Awards
    • Podcasts
    • DesignFast
  • Videos
    • EE Videos and Interviews
    • Teardown Videos
  • EE Forums
    • EDABoard.com
    • Electro-Tech-Online.com
  • Bill’s Blogs
  • Advertise
  • Subscribe

Intel Shares Dive On Report Apple Making Own Mac Chips

April 2, 2018 By Phys.org

Intel shares dove on Monday after Bloomberg reported that Apple intends to switch to chips of its own for Mac computers in two years.

Intel shares were down more than 7.5 percent to $48.12 in late afternoon trading on the Nasdaq exchange in New York.

Apple declined to comment on the report, which cited unnamed sources as saying Apple is designing its own chips for Mac computers and could begin using them instead of Intel processors in 2020.

Apple has used chips from Intel, Qualcomm, and others in the industry, but has increasingly taken to designing its own computing engines for products.

Apple has a reputation for tightly controlling all aspects of its line-up, from hardware to software, and making its own chips fits into that strategy.

What appeared to be troubling news for Intel came as the California-based company worked to get to market with chips designed to address vulnerabilities disclosed earlier this year.

Chief executive Brian Krzanich last month said new chips would guard against hardware flaws dubbed Meltdown and Spectre which could leave millions of computing device vulnerable to hackers.

Krzanich said the next-generation Intel Xeon Scalable processors, for cloud data centers, as well as 8th generation Intel Core processors for consumer devices would be ready to ship in the second half of 2018.

The disclosure of Meltdown and Spectre roiled the computing world, prompting a series of lawsuits and a congressional inquiry about Intel’s handling of the matter.

While Intel issued patches for most devices, security experts said the flaws were more difficult to deal with because they involved hardware rather than software.

You Might Also Like

Filed Under: Fiber Optics

Primary Sidebar

EE Engineering Training Days

engineering

Featured Contributions

Integrating MEMS technology into next-gen vehicle safety features

Five challenges for developing next-generation ADAS and autonomous vehicles

Robust design for Variable Frequency Drives and starters

Meeting demand for hidden wearables via Schottky rectifiers

GaN reliability milestones break through the silicon ceiling

More Featured Contributions

EE Tech Toolbox

“ee
Tech Toolbox: 5G Technology
This Tech Toolbox covers the basics of 5G technology plus a story about how engineers designed and built a prototype DSL router mostly from old cellphone parts. Download this first 5G/wired/wireless communications Tech Toolbox to learn more!

EE Learning Center

EE Learning Center
“ee
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.
“bills
contribute

R&D World Podcasts

R&D 100 Episode 10
See More >

Sponsored Content

Designing for Serviceability: The Role of Interconnects in HVAC Maintenance

From Control Boards to Comfort: How Signal Integrity Drives HVAC Innovation

Built to Withstand: Sealing and Thermal Protection in HVAC Sub-Systems

Revolutionizing Manufacturing with Smart Factories

Smarter HVAC Starts at the Sub-System Level

Empowering aerospace E/E design and innovation through Siemens Xcelerator and Capital in the Cloud

More Sponsored Content >>

RSS Current EDABoard.com discussions

  • Safe Current and Power Density Limits in PCB Copper(in A/m² and W/m³) simulation
  • The Analog Gods Hate Me
  • Help with hall effect sensors for a milwuakee impact driver
  • How to find the resonance frequency and impedance of a planar spiral coil in HFSS?
  • Diode recovery test Irrm timing.

RSS Current Electro-Tech-Online.com Discussions

  • Raise your hand if your car had one of these:
  • Simple LED Analog Clock Idea
  • Kawai KDP 80 Electronic Piano Dead
  • Tektronix 2235 channel 1 trace unstable
  • How to make string LEDs?
Search Millions of Parts from Thousands of Suppliers.

Search Now!
design fast globle

Footer

EE World Online

EE WORLD ONLINE NETWORK

  • 5G Technology World
  • Analog IC Tips
  • Battery Power Tips
  • Connector Tips
  • DesignFast
  • EDABoard Forums
  • Electro-Tech-Online Forums
  • Engineer's Garage
  • EV Engineering
  • Microcontroller Tips
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips

EE WORLD ONLINE

  • Subscribe to our newsletter
  • Teardown Videos
  • Advertise with us
  • Contact us
  • About Us

Copyright © 2025 · WTWH Media LLC and its licensors. All rights reserved.
The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media.

Privacy Policy