A new BGA socket addresses high-performance requirements for Multi-Chip Packages – CBT-BGA-6093. The contactor is a stamped-spring pin with 31-gm actuation force per ball and a cycle life of 125,000 insertions. The self-inductance of the contactor is 0.88 nH, insertion loss less than 1 dB at 15.7 GHz, and contact resistance is less than 30m&Ohm;. The current capacity of each contactor is 4 A at 60°C temperature rise. Socket temperature range is -55 to +180°C.
The socket also features a floating guide for precise ball-to-pin alignment. The specific configuration of the package to be tested in the CBT-BGA-6093 is a BGA, 20×13-mm, 0.8-mm pitch, 322-position, 23×14 ball array. The socket is mounted using supplied hardware on the target PCB with no soldering and uses the smallest footprint to accommodate nearby passive components.
The socket uses a stiffener plate to support the back side of the PCB and allows passive components to be placed via customized pockets. This socket utilizes clamshell lid with an integrated compression mechanism. The socket is constructed with a cam-actuated lever lid with a central opening for direct thermal characterization of silicon. To use, the operator places the device inside the socket, closes the clamshell lid by latching and applies downward pressure by turning the lever. This socket can be used for hand-test and temperature cycling as well as debugging applications in development and device characterization.
Pricing for the CBT-BGA-6093 is $1,084 at qty 1 with reduced pricing available depending on the quantity required.
Ironwood Electronics, 1335 Eagandale Ct., Eagan, MN 55121, 952-229-8200 or (800) 404-0204, Fax: 952-229-8201, email@example.com, www.ironwoodelectronics.com