NXP Semiconductors N.V. announced what it asserts are the world’s smallest logic plastic packages measuring 0.9 x 1.0 x 0.35 mm with 0.3 mm pitch. The compact packaging design is suitable for leading-edge portable handheld devices such as smartphones, tablets and SD cards where chip and board space comes at a premium. According to the company, the SOT1115 package decreases package size by 10 percent for the six-pin version compared to the previous smallest package, SOT891; and the eight-pin SOT1116 decreases the package size by 60 percent, compared to the previous smallest 8-pin package SOT833, enabling manufacturers to radically minimize their PCB size. Key features of the SOT1115 and SOT1116 include the small footprint, desirable electrical contact area, and shear force resistance from the PCB. All of the company’s single-, dual- and triple-gate functions are available in these new, smaller packages.
NXP Semiconductors N.V.
408-434-3000, www.nxp.com