Semiconductors and modules graced the halls of electronica 2022. Here are some of those announced at this year’s event.

Ignion, known for its IoT antennas, announced its Antenna Intelligence Cloud, which brings new features for devices with multiple wireless standards. This updated version adds cloud-based automation for IoT antenna designs with up to five radios, which helps engineers designing IoT projects easier and with less risk through accurate performance prediction and device-tailored design files. Antenna Intelligence Cloud also provides detailed reports and makes suggestions for antenna choices.

OKdo, part of RS Group Plc, launched a compact-form-factor ROCK 5B octo-core single-board computer (SBC). Based on Rockchip RK3399‐T Arm big.LITTLE technology (Dual Cortex, Quad ) processor, the SBC provides 4 GB of LPDDR4 memory, a 4k HDMI port, five USB ports (2 USB2 + 2 USB3 + Type-C PD), Wi-Fi 5 (802.11ac), Bluetooth 5 BLE, and a GbE port. It also contains two UARTS for communication and control of IoT devices.

Pearl Semiconductor announced what the company claims is the first true single-die reference clock technology. Called SingleDie, the technology enables the embedding of a MEMS surface acoustic wave (SAW) resonator into a larger CMOS IC on the same die. The result is a very low-noise, on-chip reference clock platform suitable for automotive and industrial applications in harsh operating environments.

Pearl uses SilTerra’s AlN Piezo SAW MEMS technology, which offers high-performance integration on CMOS, to build a MEMS resonator on Pearl’s CMOS die where the reference clock is integrated. Pearl has built a programmable and environment-compensated reference clock development platform on SilTerra’s CMOS technology, which can achieve sub-400 fs jitter performance; frequencies up to 1 GHz; high shock and vibration resistance; and operating temperatures of up to 125°C with better than 15 ppm stability.

Following the MEMS theme, Pickering Interfaces announced optical switches with the launch of the 65-280 (matrix) and 65-281 (multiplexer) plug-ins for the LXI 65-200 platform. The 65-28x plug-ins feature a range of high-density configurations up to 16×16 (matrix) and 32:1 (multiplexer) for a single plug-in. The matrix and MUX devices utilize MEMS technology, employing micro-mechanical mirrors to steer the optical signal, as opposed to optical prism devices. The 65-280 plug-ins have five different matrix options — 2×2, 4×4, 5×5, 8×8 & 16×16, while the 65-281 plug-ins are available in 1:1 (SPST), 2:1, 4:1, 8:1, 16:1 & 32:1 multiplexer variants. Each family can have multiple banks of smaller switch sizes per plug-in, dependent on switch size and interface connector type.

Onsemi announced a series of MOSFET devices featuring top-side cooling, which can help engineers in automotive designs in motor control and DC/DC conversion. Housed in a TCPAK57 package measuring 5 mm x 7 mm, the Top Cool devices feature a 16.5 mm² thermal pad on the top side,which allows heat to dissipate directly into a heatsink rather than through a PCB.

Power Integrations announced the InnoSwitch4-Pro family of digitally controllable, offline Zero Voltage Switching (ZVS) flyback switcher ICs. The devices combine 750 V PowiGaN primary switch, controller, FluxLink isolation, I²C interface, active clamp drive and synchronous rectification in a single IC, exceeding 95% efficiency without heatsinks in ultra-compact, USB PD and UFCS compatible adapters up to 220 W.

Renesas Electronics expanded its low-power WAN product line for smart cities, smart homes, medical devices, and industrial applications. The RYZ024A supports Cat-M1 and NB-IoT (Narrowband Internet of Things) internet connectivity without the need for a gateway and consumes just 1 µA while in power-savings mode. The RYZ024A supports extended discontinuous reception (eDRX) and has an extended voltage range from 2.2 V to 5.5 V.

Similar to its predecessor, the RYZ014A module, the RYZ024A offers Cat-M1 wireless connection capability while adding the option to integrate NB-IoT. NB-IoT uses only a portion of the available spectrum, making it more power efficient. NB-IoT also offers coverage depth that includes underground and in enclosed spaces. The module provides two power amplifier output levels: 20 dBm and 23 dBm. The RYZ024A is being developed in collaboration with Sequans

Skyworks and Sequans Communications introduced the SKY66431, a 5G Massive IoT system-in-package (SiP), which combines Sequans Monarch 2 modem with Skyworks RF front-end. According to Skyworks, the SKY66431 is the world’s smallest LTE-M/NB-IoT connectivity platform in a single package. The SKY66431 is a highly integrated multi-band, multi-chip SiP supporting 5G Massive IoT platforms. The SKY66431 is being certified by a number of industry and regulatory agencies, as well as multiple network operators. This SiP is available now for select customers, with general availability expected in Q1 2023.