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Rochester Electronics reconstructs discontinued semiconductor devices

March 1, 2010 By ECN Staff

NEWBURYPORT, Mass. (February 24, 2010) – Rochester Electronics, the world’s
largest authorized manufacturer of discontinued semiconductors, provides
authorized reverse-engineering services to re-create, manufacture and distribute
pin-for-pin replacement parts with matched cycle for cycle timing for
aftermarket semiconductor devices. Through its unique Rochester Semiconductor
Replication Process (SRP), customers can avoid system re-qualification
steps as the Rochester-designed and manufactured parts deliver the same
specifications and performance characteristics as the original products.
 Rochester engineers deconstruct and electrically analyze the critically needed
semiconductor device, re-design the part using scope and scanning electron
microscope (SEM) images, and re-engineer it onto a matched mature foundry
process to replicate the original components.

Even when the IP and design archives are no longer
available, Rochester’s design engineers can build the semiconductor component
from scratch. In some cases, Rochester engineers can add capabilities and
technologies to the semiconductor device to make it RoHS compliant, or achieve
commercial-to-military upgrades, radiation-hardened level enhancements, higher
temperature tolerances, and other performance improvements.

In addition, the
re-creation and manufacturing of semiconductor devices provided by Rochester is
authorized by the original manufacturer, eliminating any potential legal issues
from patent or IP infringement.

“Unlike most companies that merely emulate the
performance characteristics and parameters of a discontinued semiconductor
device, Rochester re-creates exact duplicates of the original part through its
precise Semiconductor Replication Process. Even when the original IP is no
longer available, our experienced design engineers can re-build a semiconductor
device that is virtually identical to the original to provide a continuing,
long-term supply of silicon wafers and finished devices,” said Paul Gerrish,
co-president of Rochester Electronics.  “The modern-day semiconductor foundries
support a tighter process window than was originally achieved resulting in a
more consistent high-quality, high performance semiconductor.

Rochester has already
successfully reversed-engineered processors, ASICS, co-processors, controllers,
memory, Op Amps, logic and linear semiconductors with voltages ranging from 3V
to 100V and line widths as small as .18 microns. Recently re-created devices
include several ASICS, Texas Instruments TMS32044 DSP, and Intel’s IXF1002 Dual
Port gigabit Ethernet controller. These Rochester re-created devices have
provided a reliable continuous supply of end-of-life semiconductors to the
aerospace, telecomm, military and medical industries.

For more information
visit: www.rocelec.com.

Filed Under: Automotive, Components

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