Winbond Electronics Corp. announced a family of new SpiFlash Serial Flash memories with the industry’s smallest packages per density, according to the company. The small form factors make them appropriate for space-critical designs, such as smart phones, Bluetooth headsets, cameras, digital video, gaming, GPS, wireless modules and other mobile/handheld products. With minimal package dimensions as small as 3.4 mm2, these devices meet the space-saving needs of the rapidly growing mobile-computing market with a range of densities from 512K-bit to 16M-bit. Available in eight-pin ultra-thin small-outline no-lead (USON) and wafer-level-ball-grid-array (WLBGA) forms, the company asserts the new SpiFlash memories occupy less than 20 percent of the space used by ordinary 30 mm2 WSON and SOIC packages. The new USON 6mm2 (2 x 3 x 0.55 mm) memories come in densities of 512 Kb, 1 Mb, 2 Mb, 4 Mb and 8 Mb in 2.5-V or 3-V versions; power-saving 1.8-V versions are also available for 2-Mb and 4-Mb densities. The 8-Mb USON is said to be the industry’s highest density available in such a package. The WLBGA devices, which use a Wafer-Level-Chip-Scale-Packages (WLCSP) assembly process, are available in 8-Mb (3.4-mm2) and 16-Mb (4.8-mm2) densities that operate at 1.8V. The WLBGAs are 0.47 mm in height. The WLBGA packages also prevent access to the chips’ signals once mounted to PCBs.

Winbond Electronics Corp.
408-943-6666, www.winbond.com