This technology breakthrough is a perfect answer to overcome the bonding challenges of demanding applications using AuSn and Indium, such as optoelectronics assembly (laser bar, VCSELs) and imaging sensors (IR-FPA).
SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Die-to-Die, Die-to-Wafer Bonding and Nanoimprint Lithography solutions. With more than 300 Device Bonders installed worldwide, SET is globally renowned for the unsurpassed placement accuracy and the high flexibility of its Flip Chip bonders. From the KADETT semi-automated R&D Device Bonder to the automated FC150 and FC300, SET offers a continuous process path from research to production. SET bonders cover most bonding technologies and offer the unique ability to handle and bond both fragile and small components onto substrates up to 300 mm. SET is a wholly owned subsidiary of Replisaurus Technologies. Further information is available on www.set-sas.fr.