The newest additions to Balluff’s line of distance sensors feature selectable modes that allow users to choose between IO-Link, voltage (0…10 V or 1…10 V), or analog (4…20 mA) outputs. The two new variations — the BOD002M with a 50 to 100 mm working distance and a resolution down to 10 μm, and the BOD002N […]
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Balluff Wafer Mapping sensor for extremely thin end effectors
Balluff’s new wafer mapping sensor, BOH00EZ, uses a precise photoelectric sensor for quick and reliable detection of semiconductor wafers and slotting errors in FOUPS – front opening unified pods. Especially designed for use with extremely thin end effectors, it features a controlled and focused light spot, allowing it to detect wafers even just a few μm […]
Balluff inductive couplers for discrete sensors
Balluff’s inductive couplers connect up to eight discrete sensors across a small air gap, eliminating hardware failures that can occur when slip rings, connectors, or other electromechanical connections wear out. The M18 cylindrical version can connect to up to 4 discrete PNP sensors with 100 mA of output current, and the Q40 cuboid version can […]
BVS industrial cameras, SmartVision controller provides fast image processing
Balluff’s GigE and USB3 industrial cameras, when used in conjunction with our SmartVision controller, guarantee tack sharp images and high-quality inspection results. These machine vision systems provide flexibility and ease of operation, while extending a manufacturer’s vision capabilities in terms of resolution, speed, interfaces, and flexibility. These solutions provide powerful visual quality control, identification, error […]
Robust space saving flat-pack photoelectric sensor
Balluff’s new family of flat pack compact photoelectric sensors provide a powerful solution for demanding environments and industries with space restrictions. The sensors, which include a stainless-steel housing, are resistant to aggressive cleaning agents, chemicals, coolants or other media and meet the requirements for packaging, food & beverage industries. “The new flat pack photoelectric family […]
Smart photoelectric sensor is easily configured via IO-Link
Generating, transporting and processing information are central tasks in the Industry 4.0 environment. The basis for all this information is intelligent sensors which provide the required input. With its new BOS 21M ADCAP, Balluff has created a smart photoelectric sensor. The versatile all-rounder uses red light and lets you choose from among four sensor modes: background […]
Background suppressing sensors
In a sample application product presence needs to be verified—objects in a blister pack—before the sealing process occurs. The product and blister pack material can be various colors…