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CEVAdsp

DSP core moves toward 5G-Advanced

February 23, 2023 By Martin Rowe

The CEVA-XC20 DSP architecture boosts computing power and reduces energy consumption through vector threading.

Filed Under: 5G Tagged With: CEVAdsp

Our second 5G Handbook is now available

May 18, 2022 By Martin Rowe

Featuring 15 articles, the 2022 5G Handbook looks at private networks, timing, connectivity, latency, mmWaves, test, and other topics.

Filed Under: 5G, Digital Edition Back Issue Tagged With: Benetel, CEVAdsp, Green Cubes, imec, keysighttechnologies, microchip, molex, National Instruments, Parallel Wireless, Rakuten Symphony, rohdeschwarz, SiTime, teradyne

Our second 5G Handbook is now available

May 18, 2022 By Martin Rowe

Featuring 15 articles, the 2022 5G Handbook looks at private networks, timing, connectivity, latency, mmWaves, test, and other topics.

Filed Under: Analog IC Tips Tagged With: Benetel, CEVAdsp, Green Cubes, imec, keysighttechnologies, microchip, molex, National Instruments, Parallel Wireless, Rakuten Symphony, rohdeschwarz, SiTime, teradyne

How RedCap fits into 5G and IoT

March 22, 2022 By Martin Rowe

Targeted at IoT applications, the reduced-capability in 5G will support a wide range of devices and applications that don’t need high speed, but do need low latency and high-reliability. 5G’s real promise comes not from mobile phones, but from industrial and business applications where network operators hope to recover the huge investments they’ve made in…

Filed Under: 5G, FAQ, Featured, Telecommunications, Wireless Tagged With: CEVAdsp, FAQ

Baseband modem IP supports handsets, IoT, FWA with less power

February 24, 2022 By Martin Rowe

CEVA’s PentaG2 baseband modem IP provides accelerated 4G/5G processing between RF circuits and Layer 2.

Filed Under: 5G, Applications, Telecommunications, Wireless Tagged With: CEVAdsp

Add UWB hardware and software to IC designs

July 7, 2021 By Martin Rowe

UWB hardware

CEVA’s Riviera Waves IP lets you add an Ultra-Wideband digital PHY and hardware/software MAC layer to an IC design for use in low-power devices.

Filed Under: 5G, Applications, Telecommunications, Wireless Tagged With: CEVAdsp

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