Congatec introduces six new Computer-on-Modules with 11th Gen Intel Core processors for the extended temperature range. Built with high-quality components designed to withstand extreme temperatures from -40 to +85°C, the new COM-HPC and COM Express Type 6 Computer-on-Modules provide all features and services required for reliable operation in the most challenging environments. The value package includes […]
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COM-HPC carrier board includes interfaces for programming, firmware flashing, reset
Congatec introduces the first carrier board and cooling solutions building the foundation of the new ecosystem for the brand new PICMG COM-HPC standard. They are a major milestone for the COM-HPC integration and have been created to accelerate the utilization of congatec’s COM-HPC modules based on the latest 11th Gen Intel Core processors (code name […]
AMD Ryzen embedded V2000 CPUs now on COM express modules
Congatec significantly broadens the application areas of its AMD Ryzen Embedded processor-based COM Express Type 6 platforms towards smaller but more powerful system designs by premiering the brand new AMD Ryzen Embedded V2000 processor launched on the COM Express Compact footprint. The new congatec conga-TCV2 powered by the new Ryzen Embedded V2000 processor impresses with […]
SBCs, modules incorporate new atom x6000E series processors
congatec, a leading vendor of embedded computing technology welcomes the launch of Intel’s new low-power processor generation on five embedded form factors. To be made available on SMARC, Qseven, COM Express Compact, and Mini Computer-on-Modules as well as Pico-ITX Single Board Computers (SBCs), the different Intel Atom x6000E Series processors, Intel Celeron and Pentium N & […]
Computer-on-modules integrate AI acceleration for computer vision
In parallel with the 11th Gen Intel Core processor launch (code named “Tiger Lake”), congatec announces the availability of both its first COM-HPC Client size A module and a next-generation COM Express Compact Computer-on-Module. This provides engineers the choice to further scale the performance of their existing systems or develop the next generation of products utilizing COM-HPC’s […]
Speedy MCU boards target graphic-rich multi-display gaming, digital signage apps
congatec extends its conga-TR4 series of COM Express modules with processors from the new AMD Ryzen Embedded R1000 series. Based on the acclaimed Zen microarchitecture, this new generation of energy-efficient processors delivers the best low-power computing performance in its class and is optimized for price-sensitive markets. Its function set has been slimmed down compared to […]
Vision kit carries three virtual machines/hypervisor for workload consolidation
congatec announces its new workload consolidation kit for vision-based situational awareness that is qualified by Intel as Intel IoT RFP (Ready For Production) Kit. Based on a COM Express Type 6 module equipped with Intel Xeon E2 processor, the RFP kit has three virtual machines (VMs) built on Real-Time Systems’ hypervisor technology for workload consolidation […]
SBC in 3.5-in format optimized for Gen 5 Intel Atom, Celeron, Pentium processors
congatec announces its brand new conga-SMC1/SMARC-x86 3.5-inch carrier board. The new size-optimized SMARC 2.1 carrier board in 3.5-inch form factor is application-ready and off-the-shelf deployable in small to mid-sized series in combination with any congatec SMARC Computer-on-Module available to date. Tailored to make 3.5-inch SBC designs modular, it is optimized for the Gen 5 Intel […]
Starter kit simplifies AI system development tasks
Congatec and the Japanese AI experts at Hacarus today unveiled the world’s first embedded computing kit for Artificial Intelligence (AI) that uses Sparse Modeling technology. Sparse Modeling needs little training data to make highly accurate predictions. This is an advantage for vision-based inspection systems, among others, because the reject rate is naturally lower when manufacturing […]
What is the COM Express standard?
The COM Express open standard, initially released in 2005, covers Computer on Modules (CO) and Single Board Computers (SBCs) under the auspices of the PCI Industrial Computer Manufacturer’s Group (PICMG), a consortium of equipment and system vendors, component suppliers, and end users for the embedded computer market. Open standards are not open source, but they […]
