Congatec introduces the conga-TCV2, a brand new COM Express Compact Computer-on-Module based on AMD Ryzen Embedded V2000 processors. With double the performance compared to the earlier launched AMD Ryzen Embedded V1000, the module is setting a new performance per watt benchmark, which finds its sweetest spot in 15 Watt TDP designs[1]. This extraordinary low power platform performance […]
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SMARC modules incorporate i.MX 8M Plus processor for AI, embedded vision processing
Congatec presents its brand new low power SMARC 2.1 Computer-on-Modules with NXP i.MX 8M Plus processor for industrial edge analytics, embedded vision, and artificial intelligence (AI) at embedded world 2021 DIGITAL. With its machine and deep learning capabilities, the new ultra-low-power conga-SMX8-Plus module allows industrial embedded systems to see and analyze their surroundings for situational awareness, […]
Computer-on-module HPC board features 11th gen Intel core processor
Congatec presents a brand new COM-HPC starter set at embedded world 2021 DIGITAL. Ideal for modular system designs utilizing the latest high-speed interface technologies such as PCIe Gen4, USB 4.0, and up to ultra-fast 2×25 GbE connectivity as well as integrated MIPI-CSI vision capabilities, the starter set is based on congatec’s PICMG COM-HPC Computer-on-Module conga-HPC/cTLU, which leverages 11th Gen Intel […]
Modules sport 11th Gen Intel Core processors for outdoor/in-vehicle apps
Congatec introduces six new Computer-on-Modules with 11th Gen Intel Core processors for the extended temperature range. Built with high-quality components designed to withstand extreme temperatures from -40 to +85°C, the new COM-HPC and COM Express Type 6 Computer-on-Modules provide all features and services required for reliable operation in the most challenging environments. The value package includes […]
COM-HPC carrier board includes interfaces for programming, firmware flashing, reset
Congatec introduces the first carrier board and cooling solutions building the foundation of the new ecosystem for the brand new PICMG COM-HPC standard. They are a major milestone for the COM-HPC integration and have been created to accelerate the utilization of congatec’s COM-HPC modules based on the latest 11th Gen Intel Core processors (code name […]
AMD Ryzen embedded V2000 CPUs now on COM express modules
Congatec significantly broadens the application areas of its AMD Ryzen Embedded processor-based COM Express Type 6 platforms towards smaller but more powerful system designs by premiering the brand new AMD Ryzen Embedded V2000 processor launched on the COM Express Compact footprint. The new congatec conga-TCV2 powered by the new Ryzen Embedded V2000 processor impresses with […]
SBCs, modules incorporate new atom x6000E series processors
congatec, a leading vendor of embedded computing technology welcomes the launch of Intel’s new low-power processor generation on five embedded form factors. To be made available on SMARC, Qseven, COM Express Compact, and Mini Computer-on-Modules as well as Pico-ITX Single Board Computers (SBCs), the different Intel Atom x6000E Series processors, Intel Celeron and Pentium N & […]
Computer-on-modules integrate AI acceleration for computer vision
In parallel with the 11th Gen Intel Core processor launch (code named “Tiger Lake”), congatec announces the availability of both its first COM-HPC Client size A module and a next-generation COM Express Compact Computer-on-Module. This provides engineers the choice to further scale the performance of their existing systems or develop the next generation of products utilizing COM-HPC’s […]
Speedy MCU boards target graphic-rich multi-display gaming, digital signage apps
congatec extends its conga-TR4 series of COM Express modules with processors from the new AMD Ryzen Embedded R1000 series. Based on the acclaimed Zen microarchitecture, this new generation of energy-efficient processors delivers the best low-power computing performance in its class and is optimized for price-sensitive markets. Its function set has been slimmed down compared to […]
Vision kit carries three virtual machines/hypervisor for workload consolidation
congatec announces its new workload consolidation kit for vision-based situational awareness that is qualified by Intel as Intel IoT RFP (Ready For Production) Kit. Based on a COM Express Type 6 module equipped with Intel Xeon E2 processor, the RFP kit has three virtual machines (VMs) built on Real-Time Systems’ hypervisor technology for workload consolidation […]
