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DunAn Sensing

What type of packaging exists for sensing pressure?

October 29, 2019 By Randy Frank Leave a Comment

At Sensors Expo 2019, Tom Nguyen, CEO of DunAn Sensing, explains innovative packaging for silicon microelectromechanical systems (MEMS) pressure sensor die that does not sacrifice performance. To complement its stable silicon MEMS die, DunAn Sensing is investing in packaging that takes advantage of the stability and adds flexibility without giving up performance in the package. […]

Filed Under: Sensor Tips Tagged With: DunAn Sensing

How does sensor packaging adapt for challenging applications?

February 6, 2019 By Randy Frank Leave a Comment

At the device level, packaging for microelectromechanical (MEMS) sensors is often performed by an outsourced assembly and test (OSAT) company. The sensors could include accelerometers, gyroscopes, magnetometers and microphones as well as pressure, temperature, infrared, biomedical, chemical and gas sensors. The first level of chip packaging formats includes cavity land grid array (LGA), molded cavity […]

Filed Under: Sensor Tips Tagged With: Allen-Bradley, Amkor Technology, DunAn Sensing, Rockwell Automation

How can a core simplify pressure sensing applications?

August 16, 2018 By Randy Frank Leave a Comment

pressure sensing

At Sensors Expo 2018, Gary Winzeler, Vice President of Marketing & Sales for DunAn Sensing discussed the company’s new approach to specifying pressure sensors using a core approach. DunAn introduced their Ceramic Diaphragm Core (CDC) Core pressure transducer and the MEMS DURAsense Core (MDC) at Sensor Expo. Both allow pressure measurements to pumps, valves and […]

Filed Under: Sensor Tips Tagged With: DunAn Sensing

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