imec presents a pioneering IEEE 802.15.4z compliant impulse radio (IR) ultra-wideband (UWB) transceiver for high-precision ranging. Building on a cost-efficient silicon implementation, imec’s transceiver chip accomplishes a 1.4mm ranging precision and comes with record low power consumption. As such, it paves the way for a variety of innovative (automotive) applications. One use case includes the…
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Low-power PLL generates mmWave radar signals
This week, at the 2023 International Solid-State Circuits Conference, imec presents a novel digitally calibrated charge-pump (CP) phase-locked loop (PLL) that can generate high-quality frequency-modulated continuous-wave (FMCW) signals for mmWave radars at low power consumption. The novel PLL is a critical building block for future short-range automotive (in-cabin and out-of-cabin) and industrial (e.g., on-cobot sensing)…
Our second 5G Handbook is now available
Featuring 15 articles, the 2022 5G Handbook looks at private networks, timing, connectivity, latency, mmWaves, test, and other topics.
Our second 5G Handbook is now available
Featuring 15 articles, the 2022 5G Handbook looks at private networks, timing, connectivity, latency, mmWaves, test, and other topics.
Orchestration at the edge reduces network latency
Edge computing brings benefits to users by reducing network latency, thus improving services, but needs management orchestration. Here, we demonstrate how orchestration improves latency in an automotive edge-computing use case be reallocating network resources. Multi-access edge computing (MEC), commonly called “edge computing,” moves data processing to the edge of communication networks. Bringing computing close to…
3D-printed impingement cooling chills high-performance chips
Imec, the research and innovation hub in nano-electronics and digital technology, today announced that it has demonstrated for the first time a low-cost impingement-based solution for cooling chips at the package level. This achievement is an important innovation to tackle the ever-increasing cooling demands of high-performance 3D chips and systems. High-performance electronic systems are coping […]
Analog Devices, imec partner to create utlra-low power sensor devices for IoT
Imec, and Analog Devices, Inc. announced they have entered into a strategic research partnership to develop the next generation of Internet of Things (IoT) devices. With two initiatives already underway, imec and ADI aim to innovate devices that are not only low-power but that also come with largely improved—or completely new—sensing capabilities. The IoT continues […]
