Supporting the needs of the electro-mobility market, Infineon Technologies AG launches its new product family: the CoolMOS CFD7A series. These silicon-based, high-performance products can be used in both the PFC and the DC-DC stage of on-board charger systems and HV-LV DC-DC converters specifically optimized for electric-vehicle applications. With long experience in the automotive field, Infineon combines highest […]
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Superjunction MOSFETs target bridge rectification, inverters, low-frequency power switching
Infineon Technologies AG develops solutions for highest efficiency and quality requirements. The newly launched 600 V CoolMOS S7 product family leads the way for power density and energy efficiency for applications where MOSFETs are switched at a low frequency. The key features of the CoolMOS S7 product family include optimization for conduction performance, improved thermal resistance, […]
SiC MOSFETs handle 650 V
Infineon Technologies AG expands its comprehensive silicon carbide (SiC) product portfolio with 650 V devices. With the newly launched CoolSiC MOSFETs, Infineon is addressing the growing demand for energy efficiency, power density, and robustness in a wide range of applications. Amongst them are server, telecom and industrial SMPS, solar energy systems, energy storage and battery formation, UPS, motor drives as […]
Variable-speed motor drive controller includes ARM Cortex-MO core
Infineon Technologies AG is releasing the new IMC300 motor controller series. It combines the iMOTION Motion Control Engine (MCE) with an additional microcontroller based on the Arm Cortex-M0 core. IMC300 complements the IMC100 series and aims at variable speed drives that require very high application flexibility. Both families, IMC100 and IMC300, share the same implementation […]
High-efficiency 600-V superjunction MOSFETs target charger, power adapter apps
Building on superjunction technology innovations and more than 20 years of experience, Infineon Technologies AG broadens its CoolMOS portfolio with the PFD7 product family combining best-in-class performance with state-of-the-art ease of use. The devices are suitable for ultrahigh power-density designs such as chargers and adapters as well as for low-power drives and specific lighting applications. Robustness […]
Source-Down packaging comes to 25-V power MOSFETs
Infineon Technologies AG is focusing on system innovation with enhancements on component level by addressing the challenges of modern power management designs. The Source Down is the new industry standard packaging concept. The first wave of power MOSFETs launched in this new package is the OptiMOS 25 V in a PQFN 3.3×3.3 mm. The device sets […]
Multi-mode, forced-frequency-resonant digital power controller targets fast-charger designs
Infineon Technologies AG launches the XDP digital power XDPS21071, the first flyback controller in the industry with zero-voltage switching (ZVS) on the primary side to achieve high efficiency. This controller is aimed at fast-charging applications such as USB-PD or QuickCharge. Light-load efficiency is optimized for variable output applications. The XDPS21071 is a high-performance digital flyback […]
IGBT 1,200V/900-A-rated modules handle industrial drives, heavy-duty vehicles, power inverter apps
Infineon Technologies AG has introduced the TRENCHSTOP IGBT7 1200 V module which provides a leading nominal current of 900 A enabling a 30 percent higher inverter output current for the same frame size compared with the former technology. While specific improvements of the module’s chip and housing directly aim at industrial drive applications, it can […]
Why GaN will be key to feeding power-hungry 5G networks
By Francesco Di Domenico, Principal Application Engineering at Infineon Technologies As cellular network operators begin to switch on and deliver the 5G experience, the world awaits with mounting anticipation of the benefits the new mobile network technology will bring. Consumers can expect higher bandwidth, lower latency and more advanced service delivery from 5G, but it…
Security cryptocontroller targets contactless payment apps
Infineon Technologies AG new 40nm generation of security chip solutions – the SLC3x – is based on a design concept that provides performance and scalability for a vast array of smart card applications and beyond. Smart card manufacturers and payment solution providers will benefit from a family architecture based on the de-facto industry standard Arm. […]
