A new high-performance elastomer socket for 1.27-mm-pitch QFN packages called the SG-MLF-7103 socket is designed for a 6.15×5.15-mm package size and operates at bandwidths up to 30 GHz with less than 1 dB of insertion loss (GSSG configuration). The contact resistance is typically 20 mΩ/pin. Network analyzer reflection measurements for the G-S-S-G case were taken […]
ironwoodelectronics
Sockets handle UFS and eMMC chip packages
New Grypper test sockets for eMMC and UFS BGA devices support the variety of sizes that 153 ball eMMC and UFS devices are produced, ranging from 7.5×7.5 mm to the 11.5×13.0 -0.50-pitch size. Ironwood Grypper socket, part number GR1135-XXXX, was designed for the new UFS 4.0 form factor of 153 BGA 11.0×13.0 – 0.50-pitch. To […]
Lever-actuated open-top spring pin socket for BGA256 packages
A new stamped-spring pin socket addresses high-performance requirements for testing BGA256 packaged devices. Called the CBT-BGA-6122, the socket’s contactor is a stamped spring pin with 31-gm actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss less than 1 dB at 15.7 GHz and […]
Package converter technology allows use of SMT devices on through-hole PCBs
A new adapter for the three-pin TO-205AF packaged MOSFET device allows use of the equivalent product in an SOIC package to be used in PCBs developed for TO packages. The PC-SOT23-TO39-01 is mapped specifically for the Microchip N-channel logic level MOSFET 2N6901. These adapters use an Ironwood-exclusive technology that allows a highly reliable and cost-effective […]
40-GHz-bandwidth sockets handle BGA121 chip packages
A new high-performance elastomer socket for 0.5-mm-pitch BGA packages, called the CG25-BGA-2002, is designed for a 6×6-mm package size and operates at bandwidths up to 40 GHz with less than 1 dB of insertion loss (GSSG configuration). The contact resistance is typically 20 mΩ/pin. Network analyzer reflection measurements for the G-S-S-G case were taken with […]
Stamped-spring pin sockets handle BGA289 chip packages
A new socket addresses high-performance requirements for testing BGA289-packaged ICs.The contactor on the SBT-BGA-6577 socket is a stamped-spring pin with a 31-gm actuation force per ball and cycle life of 125,000 insertions. The self-inductance of the contactor is 0.88 nH, insertion loss is less than 1 dB at 15.7 GHz, and capacitance is 0.097 pF. […]
Elastomer sockets handle high-bandwidth 0.508-mm pitch 132QFP packages
A new high-performance QFP socket for 0.508-mm pitch 132-pin QFP packages called the SG-QFE-7025 socket is designed for a 19.39×19.39×4.22-mm package size with 24.79×24.79-mm lead tip-to-tip and operates at bandwidths up to 30 GHz with less than 1 dB of insertion loss. The contact resistance is typically 20 mΩ per I/O. The socket connects all […]
94-GHz BGA sockets handle Xilinx FFVB676 packages
A new BGA socket design uses high-performance elastomer capable of 94 GHz and features a low inductance for use in applications characterized by wide temperature ranges. The GT-BGA-2175 socket is designed for a 27×27-mm package size and operates at bandwidths up to 94 GHz with less than 1 dB of insertion loss. The socket is […]
Sockets handle BGA472 packages, perform like direct solder connections
A new BGA socket design uses high-performance elastomer capable of 94 GHz, features low inductance and handles wide temperature applications. The GT-BGA-2164 socket is designed for a 23×23-mm package size and operates at bandwidths up to 94 GHz with less than 1 dB of insertion loss. The socket is designed with a screw-down lid and […]
High-temperature spring-pin sockets handle LGA464 packages
A new LGA socket addresses high-performance requirements for 1.5-mm-pitch LGA464 packages. The CBT-LGA-5037 socket’s contactor is a stamped-spring pin with 19-gm actuation force/pin and cycle life of 125,000 insertions. The self-inductance of the contactor is 0.93 nH, insertion loss is < 1 dB at 23 GHz, and capacitance is 0.097 pF. The current capacity of […]
