A new stamped-spring pin socket addressing high performance requirements for testing BGA780 packages is called the CBT-BGA-7054. The contactor is a stamped-spring pin with 31-gm actuation force per ball and cycle life of 125,000 insertions. The self-inductance of the contactor is 0.88 nH, insertion loss < 1 dB at 15.7 GHz, and capacitance 0.097 pF. […]
ironwoodelectronics
Clamshell production test socket handles ASE’s 361 LFBGA packages
A new stamped-spring pin socket addresses high-performance requirements for testing BGA361 – CBT-BGA-7056 packages. The contactor is a stamped-spring pin with 31 gm actuation force per ball and a cycle life of 125,000 insertions. The self-inductance of the contactor is 0.88 nH, insertion loss is less than 1 dB at 15.7 GHz, and capacitance 0.097 […]
Removable-lid spring-pin socket handles QFN28 packages
A new QFN socket addresses high performance requirements for custom size devices. Called the CBT-QFN-7071, the socket contactor is a stamped-spring pin with 14.5-gm actuation force per pin and a cycle life of 100,000 insertions. The self-inductance of the contactor is 0.98 nH, insertion loss is below 1 dB at 31.7 GHz, and the capacitance […]
Sockets enable fast swap-out of BGA devices for development sorting, failure analysis
Grypper sockets for BGA components used on Memory cards are great for enabling fast swap-out of BGA devices for development sorting and failure analysis. The Grypper socket allows operators to simply snap-in the BGA device – No Lid needed. The Grypper sockets are the same size as the device, so they will reflow directly onto […]
Chip sockets provide 75-GHz bandwidth for 0.25-mm-pitch devices
A new 0.25-pitch socket uses a high-performance elastomer capable of 75 GHz with low inductance and capable of working in a wide temperature range. The 1280 WLCSP socket is designed for a 10×8-mm package size and operates at bandwidths up to 75 GHz with less than 1 dB of insertion loss. The contact resistance is […]
Extreme temperature sockets facilitate testing 216-lead quad flat pack devices
A new Stamped spring pin socket addresses high-performance requirements for testing 216-lead Quad flat packs – CBT-QFE-3021. The contactor used in the CBT-QFE-3021 socket is a stamped-spring pin with 14-g actuation force per lead and cycle life of 125,000+ insertions. The self inductance of the contactor is 0.88 nH, insertion loss is < 1 dB […]
52-GHz-bandwidth sockets handle Kyocera optical QFN packages
A new high-performance low-profile elastomer socket handles 0.5-mm-pitch QFN packages. The SG25-QFN-2017 socket is designed for a 4×4-mm package size and operates at bandwidths up to 52 GHz with less than 1 dB of insertion loss (GSSG configuration). The contact resistance is typically 20 mΩ/pin. Network analyzer reflection measurements for the G-S-S-G case were taken […]
52-GHz bandwidth socket handles Maxim’s CTBGA package
A new high-performance elastomer socket for 0.8-mm-pitch BGA package called the SG25-BGA-2067 socket is designed for an 8×8-mm package size and operates at bandwidths up to 52 GHz with less than 1 dB of insertion loss (GSSG configuration). The contact resistance is typically 20 mΩ per pin. Network analyzer reflection measurements for the G-S-S-G case […]
Spring-pin sockets for 1-mm-pitch BGA and LGA packages
A new socket addresses high-performance requirements for burn-in and test applications. The SBT-BGA-6048 has a contactor that is a stamped spring pin with a 19-gm actuation force per ball and has a cycle life of 125,000 insertions. The self-inductance of the contactor is 0.93 nH, the insertion loss is < 1 dB at 14.1 GHz, […]
Stamped-spring pin sockets handle 0.8-mm-pitch Amkor FCLBGA packages
A new socket addresses high-performance requirements for burn-in and test applications of flip chip lidded ball grid arrays. The SBT-BGA-6562 device incorporates a contactor that is a stamped-spring pin with 30-gm actuation force per ball and cycle life of 125,000 insertions. The self-inductance of the contactor is 0.95 nH, insertion loss of < 1 dB […]
