The 297 BGA socket is one of many newer LPDDR4X and LPDDR5 Grypper test sockets. This socket uses the Grypper contacting technology that allows the test socket to be placed in the exact location as the device. The Grypper socket has the same footprint as the device and requires no lid to hold the device […]
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Lever-actuated open-top spring-pin socket handles BGA780 packages
A new stamped-spring pin socket addressing high performance requirements for testing BGA780 packages is called the CBT-BGA-7054. The contactor is a stamped-spring pin with 31-gm actuation force per ball and cycle life of 125,000 insertions. The self-inductance of the contactor is 0.88 nH, insertion loss < 1 dB at 15.7 GHz, and capacitance 0.097 pF. […]
Clamshell production test socket handles ASE’s 361 LFBGA packages
A new stamped-spring pin socket addresses high-performance requirements for testing BGA361 – CBT-BGA-7056 packages. The contactor is a stamped-spring pin with 31 gm actuation force per ball and a cycle life of 125,000 insertions. The self-inductance of the contactor is 0.88 nH, insertion loss is less than 1 dB at 15.7 GHz, and capacitance 0.097 […]
Removable-lid spring-pin socket handles QFN28 packages
A new QFN socket addresses high performance requirements for custom size devices. Called the CBT-QFN-7071, the socket contactor is a stamped-spring pin with 14.5-gm actuation force per pin and a cycle life of 100,000 insertions. The self-inductance of the contactor is 0.98 nH, insertion loss is below 1 dB at 31.7 GHz, and the capacitance […]
Sockets enable fast swap-out of BGA devices for development sorting, failure analysis
Grypper sockets for BGA components used on Memory cards are great for enabling fast swap-out of BGA devices for development sorting and failure analysis. The Grypper socket allows operators to simply snap-in the BGA device – No Lid needed. The Grypper sockets are the same size as the device, so they will reflow directly onto […]
Chip sockets provide 75-GHz bandwidth for 0.25-mm-pitch devices
A new 0.25-pitch socket uses a high-performance elastomer capable of 75 GHz with low inductance and capable of working in a wide temperature range. The 1280 WLCSP socket is designed for a 10×8-mm package size and operates at bandwidths up to 75 GHz with less than 1 dB of insertion loss. The contact resistance is […]
Extreme temperature sockets facilitate testing 216-lead quad flat pack devices
A new Stamped spring pin socket addresses high-performance requirements for testing 216-lead Quad flat packs – CBT-QFE-3021. The contactor used in the CBT-QFE-3021 socket is a stamped-spring pin with 14-g actuation force per lead and cycle life of 125,000+ insertions. The self inductance of the contactor is 0.88 nH, insertion loss is < 1 dB […]
52-GHz-bandwidth sockets handle Kyocera optical QFN packages
A new high-performance low-profile elastomer socket handles 0.5-mm-pitch QFN packages. The SG25-QFN-2017 socket is designed for a 4×4-mm package size and operates at bandwidths up to 52 GHz with less than 1 dB of insertion loss (GSSG configuration). The contact resistance is typically 20 mΩ/pin. Network analyzer reflection measurements for the G-S-S-G case were taken […]
52-GHz bandwidth socket handles Maxim’s CTBGA package
A new high-performance elastomer socket for 0.8-mm-pitch BGA package called the SG25-BGA-2067 socket is designed for an 8×8-mm package size and operates at bandwidths up to 52 GHz with less than 1 dB of insertion loss (GSSG configuration). The contact resistance is typically 20 mΩ per pin. Network analyzer reflection measurements for the G-S-S-G case […]
Spring-pin sockets for 1-mm-pitch BGA and LGA packages
A new socket addresses high-performance requirements for burn-in and test applications. The SBT-BGA-6048 has a contactor that is a stamped spring pin with a 19-gm actuation force per ball and has a cycle life of 125,000 insertions. The self-inductance of the contactor is 0.93 nH, the insertion loss is < 1 dB at 14.1 GHz, […]
