New Grypper test sockets handle any BGA devices including large array ASICs and the smallest I/O down to 0.35-mm pitch. The Grypper socket can be designed to any I/O count specific to custom BGA requirements. The Ironwood Grypper G80 LIF socket, part number GR1005-XXXX, allows the testing of an 896-I/O, 31.0×31.0-pitch BGA package. This design […]
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Clamshell spring-pin socket handles Intel FBGA packages
A new BGA socket addresses high-performance requirements for FineLine Ball grid Array packages. The CBT-BGA-6111 socket has a contactor that is a stamped-spring pin with a 19-gm actuation force per ball and a cycle life of 125,000 insertions. The self inductance of the contactor is 0.93 nH, insertion loss is less than 1 dB at […]
Spring-pin socket handles LGA104 packages
A new LGA socket addresses high-performance requirements for 0.52-mm-pitch LGA104 packages. Called the CBT-LGA-5031, it contains a contactor that is a stamped spring pin with 14-gm actuation force per pin and cycle life of 125,000 insertions. The self inductance of the contactor is 0.98 nH, insertion loss is below 1 dB at 10 GHz and […]
Clamshell-lid spring-pin socket holds QFN48 packages
A new QFN socket addresses high-performance requirements. The VQFN – CBT-QFN-7077 contactor is a stamped-spring pin with 31-gm/pin actuation force and cycle life of 125,000 insertions. The self-inductance of the contactor is 0.88 nH, insertion loss is below 1 dB at 15.7 GHz, and capacitance is 0.097pF. The current capacity of each contactor is 4 […]
Sockets handle 0.92-mm-pitch 53×53-array BGA2736 packages
A new BGA socket design uses a high-performance elastomer capable of 94 GHz, very low inductance and wide temperature applications. The GT-BGA-2145 socket is designed for a 50×50-mm package size and operates at bandwidths up to 94 GHz with less than 1 dB of insertion loss. The socket is designed to dissipate 200 W using […]
Large I/O test sockets target ASIC development
Grypper test sockets are for any BGA devices including large array ASICs. The Grypper socket can be designed to any I/O count specific to custom ASIC requirements. Ironwood Grypper G80 LIF socket, part number GR1005-0003, allows testing of an 896 I/O – 31.0×31.0-pitch BGA package. The Grypper socket fits in the same location/PCB footprint as […]
High-performance socket handles 184-position 0.15-mm-pitch QFN packages at high temperature
A new high-performance QFN socket handles 0.15-mm-pitch devices. The SS-QFN184A-01 socket, designed for a 9.2×6-mm package size, operates at bandwidths up to 23.8 GHz with less than 1 dB of insertion loss. Designed for up to 500,000 actuation cycles, the socket is able to dissipate up to 2 W over a temperature range of –40 […]
WLCSP packages get 52-GHz-bandwidth sockets
A new high-performance elastomer socket is designed to handle 0.35-mm-pitch WLCSP packages. The SG25-BGA-2071 socket is designed for a 4.525×4.525-mm package size and operates at bandwidths up to 52 GHz with less than 1 dB of insertion loss (GSSG configuration). The contact resistance is typically 20 mΩ/pin. Network analyzer reflection measurements for the G-S-S-G case […]
High-temperature sockets handle new LGA297 packages
A new LGA socket addresses high performance requirements for 0.5-mm pitch LGA297–CBT-LGA-5029 packages. The contactor has a stamped-spring pin with a 31-gm actuation force/pin and a cycle life of 125,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss is less than 1 dB at 15.7 GHz, and capacitance is 0.097pF. The […]
LGA56 sockets perform as well as direct-solder versions
A new LGA socket design uses a high-performance elastomer capable of 94 GHz and providing low inductance for ATE applications. The GTP-LGA-1002 socket is designed for a 10×10-mm package size and operates at bandwidths up to 94 GHz with less than 1 dB of insertion loss. The contact resistance is typically 30 mΩ/pin. The socket […]
