KIOXIA America, Inc. announced that it has started sampling new Automotive Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices. The new lineup utilizes KIOXIA cutting-edge BiCS FLASH 3D flash memory and is available in capacities from 64 gigabytes (GB) to 512GB to support the various requirements of evolving automotive applications that elevate driver experiences. […]
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UFS embedded flash memory suports MIPI M-PHY v5.0
KIOXIA America, Inc. announced sampling1 of the industry’s first2 Universal Flash Storage (UFS)3 embedded flash memory devices supporting MIPI M-PHY v5.04. The new lineup utilizes the company’s BiCS FLASH 3D flash memory and is available in three capacities: 128GB, 256GB, and 512GB. The new devices deliver high-speed read and write performance and are targeted to a variety of […]
UFS Ver. 3.3 embedded flash memory devices incorporate QLC technology for high density applications
KIOXIA America, Inc. announced the launch of its Universal Flash Storage (UFS)* Ver. 3.1 embedded flash memory devices with 4-bit-per-cell, quadruple-level cell (QLC) technology. For applications needing high density, such as cutting-edge smartphones, KIOXIA QLC technology enables the capability to achieve the highest densities available in a single package. The new 512 Gigabyte** QLC UFS PoC […]
Serial-attached SCSI 24G SSDs target servers, enterprise storage
KIOXIA America, Inc. (formerly Toshiba Memory America, Inc.) became the first company to bring 24G SAS to server and storage applications with the introduction of its 6th-generation enterprise SAS SSD family. First demonstrated at Flash Memory Summit 2019, KIOXIA’s new PM6 Series of enterprise SAS SSDs is built on 24G SAS technology. Designed for modern IT […]
