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lairdperformancematerials

Silicone-free gap filler features high thermal conductivity

February 26, 2021 By Redding Traiger

Laird Performance Materials continues to focus on innovation with its release of its Tflex SF10 Series, a silicone-free gap filler delivering 10 W/mk thermal conductivity along with low deflection properties enabling it to exert minimal pressure on delicate components. Along with no silicone and its high thermal conductivity, a key differentiator of Laird’s Tflex SF10 […]

Filed Under: Power Electronic Tips Tagged With: lairdperformancematerials

Gasket material suppresses signal interference, reduces force on sensitive electronic components

May 26, 2020 By Aimee Kalnoskas

As design engineers create smaller and more powerful electronics, they must place sensitive components closer together, which can increase to damaging levels the force placed on these components. A new fabric-over-foam gasket from Laird Performance Materials features a soft silicone foam core with a low compression force that suppresses electromagnetic interference without damaging sensitive components. The EcoTemp […]

Filed Under: Analog IC Tips Tagged With: lairdperformancematerials

Soft, conformable EMI absorber material doubles as a gap filler

March 31, 2020 By Aimee Kalnoskas

Electronics are getting more compact, yet also more powerful, especially with the rise of 5G. Components packed into tight spaces produce complex signal interference issues, which can hinder device operability in automotive and other industries. But using standard EMI-mitigating absorbers as an interface between a radiating component and housing can put too much stress on […]

Filed Under: Analog IC Tips Tagged With: lairdperformancematerials

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