Leti today announced that the European R&D project known as PiezoMAT has developed a pressure-based fingerprint sensor that enables resolution more than twice as high as currently required by the U.S. Federal Bureau of Investigation (FBI). The project’s proof of concept demonstrates that a matrix of interconnected piezoelectric zinc-oxide (ZnO) nanowires grown on silicon can […]
leti
Ultra-narrow band transceiver achieves bandwidth of 100 Hz, doubles downlink power efficiency
Leti, a technology research institute of CEA Tech, will demonstrate the world’s first wireless transceiver dedicated to ultra-narrow band (UNB) communication at the joint conferences of IEEE Radio Frequency Integrated Circuits (RFIC 2017) and the International Microwave Symposium (IMS 2017) in Honolulu, Hawaii, June 4-9. UNB is an enabling technology for low-cost and low-power wide-area […]
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Development platform integrates and manages IoT devices with generic APIs
Leti, a research institute of CEA Tech, today announced the release of its middleware for the SensiNact Internet of Things (IoT) platform for open-source development. Under development and trials since 2010, SensiNact is a unified framework for integrating, and managing IoT devices via generic application programming interfaces (APIs). It enables the collection, aggregation and secure […]
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Leti and Qualcomm collaborate on 3D tech for high-density, high-performance ICs
Leti, an institute of CEA Tech, today announced the continuation of its collaboration with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to develop CoolCube™, Leti’s new sequential integration technology that eliminates the need for through-silicon vias (TSVs) and enables the stacking of active layers of transistors in the third dimension. The extended project’s goals […]
