To support the future of connected mobility, Molex, Lisle, Ill., will unveil its latest offering at CES 2018, January 9 to 12 in Las Vegas. Molex will offer private demos of its connected vehicle technology ecosystem which includes a 10 Gbps automotive Ethernet backbone that fully integrates highly reliable signal integrity, prioritization, scalability and security. […]
Lisle, Ill.-based Molex will present optical connectivity, structured cabling, and I/O and backplane systems for high-speed, high-density applications at the 29th Annual Supercomputing 2017 international conference and exhibition, being held this week in Denver. The company will feature high-density blind-mating optical backplane connectors for card, sled and drawer applications, and multi-fiber MT and VersaBeam expanded […]
Molex, based in Lisle, Ill., announced the official opening of a new technology center located in Fremont, Cal. “The new technology center will enable us to better serve our growing customer base and co-developers in the region, empower closer collaboration, and provide important access to a leading center of investment and innovation,” according to Martin […]
You might know that gold is a noble metal, whose electron shells are completely filled and unlikely to be attracted to other elements. You might know that old contacts provoke less signal noise than other metals, but did you know that contacting tin with gold will corrode the gold over time? Mixing tin contacts with […]
Molex has released the Impact zX2 backplane connector system, featuring industry-leading density and signal integrity (SI) performance, while supporting data rates of up to 28 Gbps in a modular design. The system utilizes Impel patented ground shielding and footprint technology to enhance SI performance. Customers looking to upgrade their line cards to meet ever-increasing data […]
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Two of the largest manufacturers of high-speed I/O and backplane manufacturers, Molex and TE Connectivity today announced that they have formed a Dual Source Alliance (DSA) agreement to each produce a new generation of high-speed input/output (I/O) and backplane connectors, and cable assemblies for data communications applications. Molex and TE will collaborate on the launch […]
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Molex, LLC has introduced Brad M12 Power F-Coded cordsets and receptacles, featuring an industry-leading current carrying capacity of up to 16.0A per pin with a blind-mate key design….
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By Bill Schweber Incorporating wireless connectivity into a product is now a standard design requirement for Wi-Fi, IoT, and other applications. And the good news is that it’s much easier than it was just a few years ago. While a custom design may be the best or only choice for very low-end applications (a simple […]
Molex has introduced the MXMag Gigabit Single-Port RJ45 connector. With options suitable for automated reflow-solder assembly, the integrated magnetic jack provides OEMs with a high-speed assembly solution without…
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