Nexperia announced the latest additions to its rapidly expanding portfolio of Clip-bonded FlatPower (CFP) packaged diodes for industrial and automotive applications. The latest additions include 32 planar Schottky diodes and eight hyperfast recovery rectifiers housed in the CFP15B package. They are available as standard and Q-types that meet AEC-Q101 automotive qualification standards. By bringing multiple versions […]
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MOSFETS feature low on resistance
Nexperia has introduced the PMCB60XN and PMCB60XNE 30V N-channel small-signal trench MOSFETs, with market-leading RDS(on) in the ultra-compact wafer-level DSN1006 package, to make energy go further where space is tight and battery runtime is critical. Ideal for highly miniaturized electronics like smartphones, smart watches, hearing aids, and earphones, the new MOSFETs support the trend toward greater […]
Tiny MOSFETS reduce RDS(on) by 74%
Nexperia announced the release of a new range of 20 V & 30 V MOSFETs in the world’s smallest DFN package, the DFN0603. Nexperia already offers ESD protection devices in this package, but has now succeeded in bringing it to their MOSFET portfolio, a feat as yet unmatched in the industry. Next-generation wearable and hearable devices […]
50 µA Zener diodes extend battery time and save PCB space
Nexperia announced a comprehensive range of low current voltage regulator diodes. The 50 µA Zener diode range is available in three different surface-mountable (SMD) package options, in an ultra-small Discretes Flat No-leads (DFN) package and AEC-Q101 qualified parts, providing the ultimate in customer choice and flexibility. Specified at a low test current (50 μA), the […]
ESD protection devices ensure signal integrity for USB4
Nexperia announced two PESD5V0R1BxSF extremely low clamping and capacitance bidirectional Electrostatic Discharge (ESD) protection diodes. Based on Nexperia’s TrEOS technology with active silicon-controlled rectification, the devices ensure optimal signal integrity for USB4 (up to 2 x 20 Gbps) data lines on laptops and peripherals, smartphones, and other portable electronic equipment. The PESD5V0R1BDSF is optimized for low clamping […]
Power bipolar transistors handle up to 8 A and 100 V
Nexperia announced nine new power bipolar transistors, extending its portfolio of products in the thermally and electrically advantageous DPAK package to cover applications from 2 A to 8 A and from 45 V up to 100 V. The new MJD series parts are pin-to-pin compatible with other MJD devices in DPAK-package, and they also offer significant […]
Pin packages for standard logic devices enable large logic functions to be included in small form factor systems
Nexperia announced the world’s smallest and lowest profile 14,16, 20, and 24 pin packages for standard logic devices. For example, the 16 pin DHXQFN package is 45% smaller than the industry-standard DQFN16 leadless device. Not only has it a smaller footprint compared to competitors, but the new package also offers a 25% saving in the PCB […]
650 V GaN FETs offers RDS(on) performance down to to 35 mΩ
Nexperia announced the volume availability of its second-generation 650 V power GaN FET device family, offering significant performance advantages over previous technologies and competitive devices. With RDS(on) performance down to 35 m§Ł (typical), the new power GaN FETs target single-phase AC/DC and DC/DC industrial switched-mode power supplies (SMPS), ranging from 2 kW to 10 kW, especially […]
4-channel, ESD device for high-speed interfaces protects automotive and video link applications
Nexperia has announced a new range of ESD protection devices aimed specifically at protecting the ever-increasing number of high-speed interfaces found in automotive applications, especially the in-vehicle networks (IVN) associated with infotainment and vehicle communications. As data rates increase and vehicles feature more electric content, the need for EMC protection becomes more critical, and providing […]
Half-bridge automotive MOSFETs offered space-saving LFPAK56D package
Nexperia announced a series of half-bridge (high side & low side) automotive MOSFETs constructed in the space-saving LFPAK56D package format. The half-bridge configuration of two MOSFETS is a standard building block for many automotive applications including motor drives and DC/DC converters. The new package provides a half-bridge solution in one device, occupying 30% lower PCB […]
