NXP Semiconductors introduced the new MCUXpresso toolset, featuring new tools and resources that empower developers with enhanced scalability, usability, and portability, making it easier and faster to develop complex embedded applications. The new MCUXpresso toolset expands on existing features with new IDE offerings, including a custom-built MCUXpresso extension for Microsoft’s Visual Studio Code (VS Code), […]
nxpsemiconductor
Gallery: Cool tech on display at NXP technology days 2022
NXP puts on its technology days event in several cities to familiarize design engineers with trends in new technology and design practices. We got a chance to visit the event in the Detroit area where it had a heavy automotive feel. Though the main focus for the two-day Detroit event was automotive technology, there were […]
Development platform ties automotive gateways to wireless technologies
NXP Semiconductors announced the OrangeBox automotive-grade development platform, which integrates a wide variety of NXP wireless technologies, from broadcast radio, Wi-Fi 6, and Bluetooth, to secure car access with Ultra-Wideband (UWB) and Bluetooth Low Energy (BLE), and 802.11p-based V2X. The OrangeBox is a single, security-enhanced, modular development platform that provides a unified interface between the […]
Automotive radar transceivers feature improved phase noise, output power, noise figure
NXP Semiconductors released its 2nd generation RFCMOS radar transceiver family to production. The TEF82xx is the successor to the market-proven TEF810x, which has already shipped tens of millions of units. Optimized for fast chirp modulation, the device supports short-, medium- and long-range radar applications, including cascaded high-resolution imaging radar. It enables 360-degree sensing for critical […]
Front end modules and drivers address power needs of 5G basestations
NXP Semiconductors has announced its new higher power BTS7202 RX Front End Modules (FEM) and BTS6403/6305pre-drivers for 5G massive multiple-input multiple-output (MIMO) going up to 20 W per channel. Developed and implemented in NXP’s silicon germanium (SiGe) process, the devices operate with modest current consumption to reduce operational costs for mobile network operators (MNOs). They also offer […]
MCUs target advanced industrial and IoT edge computing tasks
The new MCX portfolio of microcontrollers is designed to advance innovation in smart homes, smart factories, smart cities and across many emerging industrial and IoT edge applications. The portfolio includes four series of devices built on a common platform and is supported by the widely adopted MCUXpresso suite of development tools and software. This combined […]
DDS connectivity software runs on vehicle network processors
RTI Connext Drive software now runs natively on NXP automotive-grade S32G vehicle network processors, enabling a zonal electrical/electronic (E/E) architecture through a flexible, modular and scalable platform. Connext Drive is RTI’s automotive-grade connectivity software based on the Data Distribution Service (DDS) Standard. Together, the companies aim to accelerate the next-generation of production-track autonomous vehicles. NXP’s […]
i.MX 8M family of chipsets to host digital audio platform
Swedish sound pioneer Dirac and NXP Semiconductors today announced a collaboration to combine one of the world’s most powerful audio chipsets with a market-leading digital audio platform. By equipping the NXP i.MX 8M family of chipsets with Dirac’s digital audio platform, OEMs can enable their devices with maximized, immersive, and adaptive sound across their complete […]
Power Electronics Top Talks in January 2019 on EDABoard.com forums
Peer-to-peer, engineer-to-engineer questions and answers from the EDABoard.com engineering community around power electronics. Click the “Read more” link and follow the entire conversation and maybe add your two cents by logging in to EDAboard.com Driving induction motor using TRIAC – The induction motor is 230VAC. I have to drive a 230VAC induction motor in both directions […]
Integrated chipset offers mobile wallet security and eSIM capabilities
NXP Semiconductors N.V. announced the new NXP SN100U, said to be the world’s first, single-die chipset featuring an embedded Secure Element (SE), Near Field Communications (NFC), and eSIM for added advanced functionality, cellular connectivity, and security. The company also introduced the SU070 standalone eSIM solution, which offers the industry’s smallest footprint and is ideal for smartphones, tablets, […]
