Parker Hannifin Corporation announced the launch of THERM-A-GAP PAD 30 and THERM-A-GAP PAD 60, the next generation of thermally conductive gap filler pads from Parker Chomerics. With the performance of 3.2 W/m-K thermal conductivity, THERM-A-GAP PAD 30 reliably conforms to rough surface irregularities and air gaps on heat-generating components. For higher performance applications, THERM-A-GAP PAD […]