PICMG announces that the COM-HPC committee has finalized the pinout and dimension definitions for the COM-HPC Mini form factor in record time. This means that the vast majority of the details of the COM-HPC Mini standard have been defined and documentation has already begun. Reaching this critical milestone enables PICMG members to start design work […]
Working group to specify MicroTCA improvements for timing and bandwidth
PICMG announces that the MicroTCA Working Group is working on the next generation of the MTCA architecture specifications initially launched in 2006. Efforts target improvements for time-sensitive and high bandwidth applications such as in high-energy physics. Current work includes accommodations for the next generation of CPUs and FPGAs that will natively support PCIe gen 5. […]
Platform management interface specification covers COM-HPC-based edge computing designs
PICMG announces the release of the COM-HPC Platform Management Interface (PMI) specification. It provides a framework of remote and out-of-band platform management features for COM-HPC Computer-on-Module-based edge computing designs and is freely available on the PICMG website. COM-HPC is an open Computer-On-Module (COM) form factor standard for High-Performance Computing (HPC) that combines high-end I/O bandwidth […]
What is the COM Express standard?
The COM Express open standard, initially released in 2005, covers Computer on Modules (CO) and Single Board Computers (SBCs) under the auspices of the PCI Industrial Computer Manufacturer’s Group (PICMG), a consortium of equipment and system vendors, component suppliers, and end users for the embedded computer market. Open standards are not open source, but they […]