By John Ferguson, Director of Product Management at Siemens Digital Industries Software 3D ICs extend heterogeneous advanced package technology into the third dimension. They carry the same design to manufacturability challenges as 2D advanced packages, and then some. Although far from mainstream, that time is coming, as chiplet standardization efforts and supporting tool developments begin […]
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PCB design best practices for ECAD/MCAD collaboration
By Alex Grange, Siemens EDA As designs grow in scope and complexity, collaboration between the electronic and mechanical domains is even more important. For example, as PCB designs face tighter requirements, problems resulting from electromechanical interference are becoming more common. Handling these problems across disciplines requires constant collaboration and synchronized data. What isn’t working today […]
Chip design software works with GF 300-mm photonics, RF-CMOS features
Siemens Digital Industries Software announced that its Calibre nmPlatform now enables designers to leverage the newest GlobalFoundries (GF) silicon photonics platform. GF’s next-generation, monolithic platform, GF Fotonix is the first in the industry to combine its differentiated 300mm photonics and RF-CMOS features on a silicon wafer, delivering best-in-class performance at scale. The GF Fotonix process […]
Power integrity analysis software certified for GF platforms
Siemens Digital Industries Software announced that its new mPower Digital solution for power integrity analysis of analog, digital, and mixed-signal IC designs is now certified for digital analysis of designs using GlobalFoundries’ (GF) platforms. The significant power and performance advancements of GF’s feature-rich platforms, equipped with advanced features such as RF, automotive, ultra-low-power memory, and […]
Hardware-assisted verification technology in the mainstream
By Jean-Marie Brunet, and Dr. Lauro Rizzatti Today, system-on-chip (SoC) devices permeate our world and propel numerous industries. They are integral for the internet of things (IoT), to power up complex 5G/6G wireless applications, sit at the core of artificial intelligence/machine learning (AI/ML) algorithmic processors, drive powerful data center computers and storage devices, and are […]
Process design kits focus on power handling IC designs
Siemens Digital Industries Software announced it has collaborated with United Microelectronics Corporation (UMC) to develop process design kits (PDKs) for the foundry‘s 110-nanometer (nm) and 180-nm BCD technology platforms. The new PDKs for UMC, which is a leading semiconductor foundry focused on logic and specialty technologies, are optimized for Siemens EDA’s Tanner custom design flow […]
Power integrity analysis software handlesTSMC N7, N5 process technologies
Siemens Digital Industries Software announced that its new mPower solution for power integrity analysis of analog, digital, and mixed-signal IC designs is now certified for TSMC’s N7 and N5 process technologies. The significant power and performance advancements of TSMC’s N7 and N5 processes make them ideal for next-generation mobile, artificial intelligence, high-performance computing, and network […]
EDA software handles Samsung foundry’s advanced processes
Siemens Digital Industries Software announced it has enabled several of its leading electronic design automation (EDA) product families for the latest versions of Samsung Foundry’s advanced processes, including Siemens’ solutions targeting advanced packaging, electrostatic discharge (ESD) rules and integrated circuit (IC) design in the cloud. Samsung has successfully evaluated Siemens’ digitally integrated High-Density Advanced Packaging […]
Grid converter puts locally generated power on power grids
Siemens presents a new power conversion system for battery storage applications. The SINAMICS PCS grid converter makes locally generated batter power usable for industrial and public power grids. SINAMICS PCS controls the charging and discharging process of the battery and helps to handle load peaks and grid disturbances via the battery storage, to store the […]
IC place-and-route software boasts speedy runtime
Siemens Digital Industries Software announced that the latest release of its Aprisa physical design solution is now available. Aprisa 21.R1 has achieved major performance and technology advancements, including dramatic improvements in both runtime and memory footprint reductions. For customers, these enhancements can translate to lower design costs and faster time-to-market. The technology advancements available in […]
