At the LEAP Awards dinner gala in Costa Mesa, Calif., the following companies were awarded trophies in the category of Embedded Computing. This year’s inaugural LEAP Awards competition honored ground-breaking new products that set a new standard for innovation. Judges rated candidates on categories that included societal impact, industry impact, technical sophistication, creativity, and value […]
The Future Car: A Siemens Podcast Gernot Spiegelberg on Musk, the migration to MaaS
Episode Info Gernot Spiegelberg: “There is only one person who’s dealt with this chicken and egg problem…it’s Elon Musk.” Dr. Spiegelberg, a researcher in Siemens AG Corporate Technology, joins Ed to discuss the move from manufacturing to MaaS, a future where avatars travel instead of people, and why the shift from internal combustion engines is […]
Finalists announced for inaugural Embedded Computing category in LEAP Awards
Three finalists were announced for the inaugural LEAP Awards’ Embedded Computing Category, comprising innovative products and technologies. The competition was scored by a panel of independent technical/engineering-oriented judges. Responsible for the Embedded Computing category were these four judges: Plamen Doynov Research Professor University of Missouri-Kansas City Plamen Doynov became a research professor in physics last […]
Not for dummies – Automotive testing & engine expos bring hot tech instrumentation to development labs
The Automotive testing expo and engine expo recently wrapped up in the Detroit area, collocated with events for automotive interiors and autonomous vehicle technology. As always, there were numerous examples of interesting technology on the show floor. In the pages that follow we highlight some of the more noteworthy developments we saw there. NEXT PAGE: […]
IC design software includes automotive-grade automatic test pattern generation technology
Mentor, a Siemens business, today announced the availability of automotive-grade automatic test pattern generation (ATPG) technology for its Tessent TestKompress software. The new technology includes a suite of fault models and test pattern generation applications that target defects in ICs at the transistor and interconnect levels – in the process helping customers capture defects that […]
EDA, Spice software supports TSMC 7-nm FinFET Plus, 5-nm FinFET processes
Mentor, a Siemens business, today announced certification for TSMC’s 7nm FinFET Plus and the latest version of 5nm FinFET processes for its Mentor Calibre nmPlatform and Analog FastSPICE (AFS) Platforms. In addition, Mentor continues to expand features of both the Xpedition Package Designer and Xpedition Substrate Integrator products supporting TSMC’s advanced packaging offerings. Mentor Calibre nmPlatform for TSMC 5nm and 7nm FinFET Plus […]
Thermal simulation package brings CFD to autonomous electric vehicle design
New Simcenter software for thermal simulation of Autonomous Electric Vehicles (AEVs) is said to be the first such package engineered to address critical, thermal-driven challenges associated with AEV design. “Strategy Analytics expects that the vast majority of self-driving cars will feature electrified powertrains,” said Ian Riches, executive director, Automotive Practice for Strategy Analytics. “The OEMs […]
Design tool generates photonic layouts for fabrication
Mentor, a Siemens business, today announced LightSuite Photonic Compiler – the industry’s first integrated photonic automated layout system. This new tool enables companies designing integrated photonic layouts to describe designs in the Python language, from which the tool then automatically generates designs ready for fabrication. The resulting design is “Correct by Calibre” – with the […]
Chip design tools now handle TSMC 5 and 7-nm FinFET IC processes
Mentor, a Siemens business, has announced that several tools in its Calibre nmPlatform and Analog FastSPICE (AFS) Platform have been certified by TSMC for the latest versions of TSMC’s 5nm FinFET and 7nm FinFET Plus processes. Mentor also announced it has updated its Calibre nmPlatform tools in support of TSMC’s Wafer-on-Wafer (WoW) stacking technology. These Mentor tools and TSMC’s […]
Emulation platform handles up to 1.25 billion gates for data center designs
Mentor, a Siemens business, today introduced the Veloce® StratoT, which expands the footprint choices and configuration options available from its Veloce Strato™ emulation platform family. The Veloce Strato platform is a third-generation, data-center friendly emulation platform, and the only emulation platform on the market with full scalability across both software and hardware. In addition, the […]
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