by Craig Armenti, Those of us who have been in the PCB design business for more than a decade either have direct knowledge of, or have heard the stories about, how the profession has evolved since the late 70’s and early 80’s. The shift from drafting tables, Mylar, and hand taping, to light tables, digitizers […]
siemens
Embedded IoT framework simplifies Industrie 4.0 device-to-cloud connections
Just when more and more equipment needs to be IoT-enabled and manageable from the cloud, OEM device manufacturers are challenged with scalability and portability amidst a fragmented market from chip vendors to silicon all the way to the cloud vendors. And even after choosing two or three cloud vendors and their respective SDKs design to […]
CFD program features better handling of LED properties
Enhancements to a computational fluid dynamics (CFD) package called FloEFD include an improved module for handling LEDs wherein the user can define light intensity and radiation spectrum as a function of angle. As a result, the FloEFD software can automatically apply the calculated radiant flux on top of the LED. Users of the package, from […]
In-system test software helps vehicular electronics meet ISO 26262 specs
Mentor announced the availability of its new Tessent MissionMode product, which provides a combination of automation and on-chip IP for enabling semiconductor chips throughout an automotive electronics system to be tested and diagnosed at any point during a vehicle’s functional operation. This capability is fundamental towards achieving the safety and long-term reliability requirements demanded by […]
Chip design CAD software supports integrated fan-out advanced packaging, chip-on-wafer-on-substrate packaging technologies
Mentor, a Siemens business, today announced several enhancements to its Calibre® nmPlatform, Analog FastSPICE™ (AFS™) Platform, Xpedition® Package Integrator and Xpedition Package Designer tools in support of TSMC’s innovative InFO integrated fan-out advanced packaging and CoWoS® chip-on-wafer-on-substrate packaging technologies. The TSMC InFO and CoWoS 3D packaging technologies enable customers to mix multiple silicon dice on a single device and […]
Chip design CAD system supports 7-nm FinFET Plus and 12-nm FinFET process technologies
Mentor, a Siemens business, today announced certification for TSMC’s 12nm FinFET Compact Technology (12FFC) and the latest version of 7nm FinFET Plus processes for its Mentor Calibre® nmPlatformand Analog FastSPICE™ (AFS™) Platform. Nitro-SoCTM place and route system is also certified to support TSMC’s 12FFC process technology. “TSMC is pleased to work closely with Mentor, which continues to increase its […]
PCB Design: changing the focus
by Craig Armenti Those of us who have been in the PCB design business for more than a decade either have direct knowledge of, or have heard the stories about, how the profession has evolved since the late 70’s and early 80’s. The shift from drafting tables, Mylar, and hand taping, to light tables, digitizers […]
Centralized processing for autonomous vehicles
Engineers say the best way to make vehicles fully autonomous is to analyze all sensor signals and driving situations with a centralized processor. AMIN KASHI, MATTHIAS POLLACH, NIZAR SALLEM, Mentor Graphics, a Siemens Business It’s no secret that elbow room may be growing scarce among the companies working on self-driving tech. A Comet Labs tally […]
Embedded Linux support for Zynq UltraScale+ MPSoCs
Mentor, a Siemens business, today announced an update to its market-leading embedded product portfolio with broad coverage for the Xilinx Zynq UltraScale+ MPSoC ZCU102 Evaluation Kit. This release provides developers with support for the unique combination of multicore processors on the MPSoC development platform with Mentor Embedded Linux, Nucleus RTOS, Mentor Embedded Hypervisor, Code Sourcery […]
Today’s complex ‘system of systems’ driving need for sophisticated tools, detailed modeling, data continuity
by Bill Schweber, Jaffa Engineering, LLC It’s not news that many of today’s products are actually a complex “system of systems” consisting of two, three and more semi-independent subsystems, each with its own complexity and intricacies. What has changed is the dramatic degree to which these constituent systems are now interrelated at more and higher […]