SK hynix announced that it has developed PIM*, a next-generation memory chip with computing capabilities. It has been generally accepted that memory chips store data and CPU or GPU, like a human brain, processes data. SK hynix, following its challenge to such notion and efforts to pursue innovation in the next-generation smart memory, has found […]
SK Hynix Inc. today introduced the industry’s first 72-Layer 256Gb(Gigabit) 3D(Three-Dimensional) NAND Flash based on its TLC(Triple-Level Cell) arrays and own technologies. The company stacks 1.5 times more cells for the 72-Layer 3D NAND than it does for the 48-Layer 3D which is already in mass production. A single 256Gb NAND Flash chip can represent 32GB(Gigabytes) […]
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