Sonics, Inc. announced that its Chinese customer, Starblaze Technology, has reached volume production in TSMC’s 28HPC process technology with the STAR1000 solid-state storage device (SSD) controller system-on-chip (SoC). Starblaze Technology used Sonics’ flagship SonicsGN NoC as the integration fabric for more than 60 cores in the design. STAR1000 is a high-end client and entry-level enterprise storage SSD controller designed to […]
Sonics, Inc. upgraded its ICE-P3 Energy Processing Unit (EPU), the flagship member of the ICE-Grain Family of EPU products, to add a new programmable Sequencer. The Sequencer enables designers of power-sensitive chips like systems-on-chip (SoC) and microcontrollers (MCU) to significantly improve control over both on-chip and external voltage and frequency resources to minimize energy consumption. The Sequencer combines the flexibility […]
Sonics, Inc. and Northwest Logic announced their partnership to deliver high throughput memory subsystem solutions for complex System-On-Chip (SOC) designs. The companies’ partnership, which is being driven by a mutual customer SOC design win, integrates Sonics’ flagship interconnect fabric, SonicsGN NoC, and Sonics’ MemMax®= memory scheduler with Northwest Logic’s family of HBM2, DDRx, LPDDRx memory controllers. […]
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Sonics, Inc., today introduced ICE-G3™, the second product in the Energy Processing Unit (EPU) family based on the ICE-Grain Power Architecture™. ICE-G3 includes all of the on-chip power management capabilities of ICE-G1™ EPU with the addition of a key new component called the cluster controller. The cluster controller supports definition of complex power states at […]