TDK Corporation presents the AVD series of new pressure transmitters, distinguishable by their extremely low-profile design and high precision. The transmitters with B58621V* ordering codes are available in three versions for different pressure measurement ranges including 0 to 16 mbar, 0 to 100 mbar, and 0 to 7 bar. The series offers high precision levels […]
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SMD transformers handle ultrasonic frequencies
TDK Corporation presents the new B78416A* series of compact EPCOS transformers with EP 6 cores for ultrasonic applications. The series comprises five types with transformation ratios between 1:1:8.42 and 1:1:15. Depending on the type, the new SMD-version transformers offer inductance values between 3 mH and 5 mH and are suitable for frequencies between 52 kHz […]
Ultrasonic ToF sensors work at short and long ranges
TDK Corporation has introduced the Chirp ICU-10201 and ICU-20201, two new high-performance, ultra-low power integrated ultrasonic Time-of-Flight (ToF) sensors for short- and long-range detection. The new MEMS sensors embed a more powerful on-chip processor with higher computational power; the enhanced processing capabilities allow a wide range of application algorithms to fit and to run on-chip, […]
MEMS microphones feature SoundWire compatibility
TDK Corporation has introduced the T5828 SoundWire MEMS microphone as part of the SmartSound family of performance products for mobile, TWS, IoT and other consumer devices. This family of high-performance microphones pushes the boundaries of microphone acoustic performance, providing advanced feature sets in small package footprints. The T5828 SoundWire MEMS microphone offers a high acoustic […]
MEMS microphones excel in high dynamic range environments
TDK Corporation introduced three new digital MEMS microphones as part of the SmartSound family of products for mobile, TWS, IoT and other consumer devices. Each of these high-performance microphones push the boundaries of microphone acoustic performance, providing advanced feature sets in small package footprints. The T5837/38 PDM MEMS microphones offer high acoustic overload point (AOP) […]
Six-axis MEMS motion sensors features supreme vibration rejection, temperature stability
TDK Corporation announced the availability of the InvenSense ICM-45xxx SmartMotion ultra-high-performance (UHP) family of 6-axis MEMS motion sensors. This family introduces the on-chip self-calibration, industry’s lowest power consumption, and world’s first BalancedGyro™ (BG) technology. BalancedGyro technology by TDK is the first-of-its-kind gyroscope MEMS architecture that enables supreme vibration rejection and temperature stability performance, an enhancement […]
Robotics development platform includes sensor pack, ROS drivers
TDK Corporation announced the newest solution to the SmartRobotics product family, TDK RoboKit1. The next-generation robotic development platform enables quick prototyping and development for robotic developers, designers, and enthusiasts, by providing a robust hardware platform accompanied by full ROS1 and ROS2 compliant drivers and software algorithms. TDK continues to dominate the robotics industry by advancing […]
Compact contactors handle up to 250 A dc, 1,000 Vdc
TDK Corporation has extended its range of bipolar DC high-voltage contactors to include the new HVC43 (B88269X3**0C011) series. These products complete the existing range by offering continuous currents from 150 A DC to 250 A DC and operating voltages of up to 1000 V DC. The contactors are available in 12 V or 24 V […]
Hybrid polymer capacitors boast enhanced ripple current capability
TDK Corporation presents with the B40640B* and B40740B* series hybrid polymer capacitors with a very high ripple current capability increased by up to 29 percent compared to preceding types. The ripple current capability is now up to 35 A (20 kHz, 125 °C). The new types are designed for a rated voltage of 63 V, […]
NTC thermistor chip optimized for direct embedding in power modules
TDK Corporation presents the new L860 NTC thermistor chip which can be directly embedded into power modules and used within sintering and AI-heavy wire bonding. Its characteristics correspond to the common MELF-R/T curve with R100 of 493 Ω. The lead-free chip with ordering code B57860L0522J500 is designed for a wide temperature range of -55 °C […]
