TDK Corporation has announced the expansion of its tunnel-magnetoresistance (TMR) angle sensor portfolio with the new digital TAD4140 sensor. Designed for demanding automotive and industrial applications, compared to TDK’s existing digital angle sensor – the TAD2141 – the new TAD4140 features full redundancy with two signal processor units and 2×2 TMR bridges in a single […]
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Ultrasonic sensor disks offer serial resonance frequency of 2000 kHz
TDK Corporation presents a new series of ceramic-based EPCOS ultrasonic sensor disks, comprising two standard types. The B59050Z0206A030 sensor disk has a diameter of 5.0 mm and thickness of 1.02 mm. With a serial resonance frequency of 2000 kHz it features thickness oscillation mode (axial), making is suitable for use in liquid media. The B59070Z0285D12* […]
Time-of-Flight sensor combines ultrasonic transducer with DSP on mixed-signal ASIC
TDK announces the immediate worldwide availability of the Chirp CH-101 MEMS-based ultrasonic Time-of-Flight (ToF) sensor. This ToF sensor utilizes a tiny ultrasonic transducer chip to send out a pulse of ultrasound and then listen for echoes returning from targets in the sensor’s field-of-view. By calculating the ToF, the sensor can determine the location of an […]
SoC development kits boost endpoint AI and Machine Learning efforts
QuickLogic Corporation, a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions, announced the launch of its Merced EOS S3AI Hardware Development Kit (HDK) to enable quick development of applications for endpoint Artificial Intelligence (AI) and Machine Learning (ML). The Merced HDK is an evaluation platform for QuickLogic’s EOS S3AI SoC […]
