TE Connectivity (TE) will showcase its Sliver interconnects at DesignCon 2018 that have been adopted as the SNIA SFF TWG Technology Affiliate’s SFF-TA-1002 specification multi-lane high speed connector. Multiple groups within the industry including the Consortium for On-Board Optics (COBO), the Gen-Z Consortium (Gen-Z), Open Compute Project (OCP) and Enterprise & Data Center SSD Working […]
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Wire-to-board right-angle, vertical PCB headers incorporate contoured retainers that snap into PCBs
TE Connectivity (TE) is adding new right-angle and vertical printed circuit board headers to its POWER TRIPLE LOCK connector product line. These through-hole headers significantly expand wire-to-board applicability for this family of connectors in appliance, HVAC, automation and control, automotive, and other industries’ designs. The new right-angle headers are offered in both standard temperature (105°C) and […]