TE Connectivity has introduced its next-generation 0.8-mm free height board-to-board connectors, which achieve unrivaled speeds of 32 Gbps and higher. These high-speed, mid-density mezzanine solutions deliver an excellent price-to-performance ratio and are 56 Gbps PAM-4 and PCIe Gen 5 capable for future upgrades. There is a growing need for mezzanine connectors capable of delivering 25 […]
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TE Connectivity partners with Annapolis Micro Systems on FPGA boards
TE Connectivity (TE) has partnered with Annapolis Micro Systems, a FPGA board and systems supplier, on the release of three new high-performance FPGA boards that feature TE’s NanoRF module. The half-size NanoRF is designed to fit into the VITA 67.3 form factor and supports 70 GHz bandwidth, with more than double the RF contact density […]
Master Electronics receives TE Connectivity Americas Distributor of the Year award
Master Electronics, the 13th largest global distributor of electronic components, was named the Americas Distributor of the Year from TE Connectivity (TE), a global leader in connectivity and sensors. This top award was presented to Master Electronics at TE’s annual distributor summit. “Master’s entrepreneurial and innovative culture supports the speedy execution of differentiated customer and […]
TE Connectivity showcases 400G connector and cable assembly solutions at OFC 2018
TE Connectivity (TE) will showcase a comprehensive lineup of high-performance connectors, sockets, cable assemblies and power solutions at the OFC 2018 conference held in San Diego, March 13 −15. TE will show these solutions in the Ethernet Alliance booth (#2648) and the Optical Internetworking Forum (OIF) booth (#5525) throughout the show. Experts will be on […]
TE Connectivity reduces high-density switch design costs with zQSFP+ stacked belly-to-belly cage
TE Connectivity (TE) has launched its zQSFP+ stacked belly-to-belly cages, which support a single printed circuit board (PCB) architecture (versus two PCBs) in each line card, saving customers significant costs. Designed for high-density switches with 48 or 64 silicon port designs, TE’s new zQSFP+ stacked belly-to-belly cages address the requirements for higher density switch designs, […]
TE Connectivity releases over 25,000 new digital models in collaboration with SnapEDA
TE Connectivity and SnapEDA, the Internet’s first parts library for circuit board design, are collaborating to make more than 25,000 new digital models available to electronics designers, helping them bring their products to market faster. Traditionally, designers have spent days creating models for each component in their designs, a tedious and time-consuming process. Some components, […]
TE Connectivity highlights 400Gbe OSFP and QSFP-DD connectivity at DesignCon 2018
TE Connectivity (TE) today announced the showcasing of OSFP and QSFP-DD connectivity products at this year’s DesignCon show that will soon enable 400-Gigabit Ethernet in a range of data center devices. TE is demonstrating the new products in booth 817 at the DesignCon 2018 expo through tomorrow, February 1 in Santa Clara, Calif. Targeted for […]
TE Connectivty and Credo demonstrate 112G single-lane connectivity at DesignCon 2018
TE Connectivity (TE) and Credo, provider of high performance, mixed-signal semiconductor solutions for the data center, enterprise networking and high-performance computing markets, today announced they have teamed up to demonstrate the future of networking technologies. The companies will hold demonstrations of 112Gbps over a chip-to-module (IO) channel and over a backplane channel at DesignCon 2018. […]
TE Connectivity showcases computing and industry innovations at DesignCon 2018
TE Connectivity (TE) will showcase its Sliver interconnects at DesignCon 2018 that have been adopted as the SNIA SFF TWG Technology Affiliate’s SFF-TA-1002 specification multi-lane high speed connector. Multiple groups within the industry including the Consortium for On-Board Optics (COBO), the Gen-Z Consortium (Gen-Z), Open Compute Project (OCP) and Enterprise & Data Center SSD Working […]
Wire-to-board right-angle, vertical PCB headers incorporate contoured retainers that snap into PCBs
TE Connectivity (TE) is adding new right-angle and vertical printed circuit board headers to its POWER TRIPLE LOCK connector product line. These through-hole headers significantly expand wire-to-board applicability for this family of connectors in appliance, HVAC, automation and control, automotive, and other industries’ designs. The new right-angle headers are offered in both standard temperature (105°C) and […]