Toshiba Memory America, Inc. today announced that it has begun sampling new Automotive UFS JEDEC Version 2.1 embedded memory solutions. The company’s Automotive UFS supports a wide temperature range (-40°C to +105°C), meets AEC-Q100 Grade2 requirements and offers the enhanced reliability required by various automotive applications. The lineup consists of four capacities: 32 gigabytes, 64GB, […]

 Toshiba Memory America, Inc.  the U.S.-based subsidiary of Toshiba Memory Corporation, announced availability of its XD5 Series NVMe SSD platform in a 2.5-inch1, 7mm low-profile form factor that is optimized for low-latency and performance consistency in read-intensive workloads. Developed for both data center and cloud environments, the new 2.5-inch form factor XD5 Series is ideal for […]

Toshiba Memory America, Inc. will introduce the fourth generation of its single package ball grid array (BGA) solid state drive (SSD) product line: the BG4 series. Toshiba Memory’s new lineup of ultra-compact NVMe SSDs places both the flash and an all-new controller into one package, bringing design flexibility to ultra-thin PC notebooks, embedded systems and server […]