Zuken announces the CR-8000 2020 release of its advanced 3D multi-board EDA environment. The latest release was developed in close collaboration with Zuken’s global customers in business sectors, including electronics, high tech, automation, automotive, aerospace, and defense. As product complexity increases, these businesses are searching for opportunities to increase design performance and process resilience. Valuable […]
PCB design package handles multiple-board EMC, extends 3D MCAD support
Zuken announces the immediate availability of CR-8000 2017.This latest release is the first to enhance electrical and electronic co-design at the architectural design phase. CR-8000 is the industry’s only 3D product-centric design solution with architecture design, concurrent 3D multi-board support, and chip/package/board co-design capabilities. CR-8000 integrates directly with Zuken’s DS-2, a comprehensive electronic and electrical design data management […]
Concurrent PCB design package includes 3D multi-board support, chip/package/board co-design
Engineers facing extremely tight design cycles will benefit from powerful new multi-user functionality in Zuken’s CR-8000. Concurrent PCB design reduces design time, meaning quicker time-to-market. In addition, a…
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3D multi-board support, chip/package/board co-design appeared first on Analog IC Tips.
