Zuken Inc., and Electro Magnetic Applications Inc. (EMA) have entered into a partnership to improve the accuracy of cable harness simulation models for complex electrical subsystems in aircraft and vehicles. The recent collaboration advances Zuken’s digital engineering initiative by enabling design teams to assess, simulate, and validate electrical and electronic designs before they reach manufacturing. […]
Zuken announces the availability of eCADSTAR release 2020. With the new release, available configurations of Zuken’s new internet connected PCB design platform, eCADSTAR, have been extended to include new modules for signal integrity, power integrity and IBIS-AMI simulation. The new modules eCADSTAR Signal Integrity, eCADSTAR Signal Integrity Advanced, eCADSTAR Power Integrity and eCADSTAR IBIS-AMI complement […]
Zuken announces the CR-8000 2020 release of its advanced 3D multi-board EDA environment. The latest release was developed in close collaboration with Zuken’s global customers in business sectors, including electronics, high tech, automation, automotive, aerospace, and defense. As product complexity increases, these businesses are searching for opportunities to increase design performance and process resilience. Valuable […]
Zuken announces the immediate availability of CR-8000 2017.This latest release is the first to enhance electrical and electronic co-design at the architectural design phase. CR-8000 is the industry’s only 3D product-centric design solution with architecture design, concurrent 3D multi-board support, and chip/package/board co-design capabilities. CR-8000 integrates directly with Zuken’s DS-2, a comprehensive electronic and electrical design data management […]
Engineers facing extremely tight design cycles will benefit from powerful new multi-user functionality in Zuken’s CR-8000. Concurrent PCB design reduces design time, meaning quicker time-to-market. In addition, a…
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3D multi-board support, chip/package/board co-design appeared first on Analog IC Tips.