Zuken announces the launch of the eCADSTAR release 2021.0. With this release, the eCADSTAR 3D PCB design has been extended to include numerous new features, including 3D creepage safety checks in the PCB design editor, improved bus management, and sheet connector cross-references in the schematic editor, and enhanced scripting in the COM interface. The new […]
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Zuken and Electro Magnetic Applications partner on cable harness design and EMI reduction
Zuken Inc., and Electro Magnetic Applications Inc. (EMA) have entered into a partnership to improve the accuracy of cable harness simulation models for complex electrical subsystems in aircraft and vehicles. The recent collaboration advances Zuken’s digital engineering initiative by enabling design teams to assess, simulate, and validate electrical and electronic designs before they reach manufacturing. […]
PCB CAD software includes signal integrity, power integrity, IBIS-AMI simulation capabilities
Zuken announces the availability of eCADSTAR release 2020. With the new release, available configurations of Zuken’s new internet connected PCB design platform, eCADSTAR, have been extended to include new modules for signal integrity, power integrity and IBIS-AMI simulation. The new modules eCADSTAR Signal Integrity, eCADSTAR Signal Integrity Advanced, eCADSTAR Power Integrity and eCADSTAR IBIS-AMI complement […]
Multi-board EDA software highlights schematic design, FPGA optimization, skew group routing
Zuken announces the CR-8000 2020 release of its advanced 3D multi-board EDA environment. The latest release was developed in close collaboration with Zuken’s global customers in business sectors, including electronics, high tech, automation, automotive, aerospace, and defense. As product complexity increases, these businesses are searching for opportunities to increase design performance and process resilience. Valuable […]
PCB design package handles multiple-board EMC, extends 3D MCAD support
Zuken announces the immediate availability of CR-8000 2017.This latest release is the first to enhance electrical and electronic co-design at the architectural design phase. CR-8000 is the industry’s only 3D product-centric design solution with architecture design, concurrent 3D multi-board support, and chip/package/board co-design capabilities. CR-8000 integrates directly with Zuken’s DS-2, a comprehensive electronic and electrical design data management […]
Concurrent PCB design package includes 3D multi-board support, chip/package/board co-design
Engineers facing extremely tight design cycles will benefit from powerful new multi-user functionality in Zuken’s CR-8000. Concurrent PCB design reduces design time, meaning quicker time-to-market. In addition, a…
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3D multi-board support, chip/package/board co-design appeared first on Analog IC Tips.
