• Skip to primary navigation
  • Skip to main content
  • Skip to primary sidebar
  • Skip to footer

Electrical Engineering News and Products

Electronics Engineering Resources, Articles, Forums, Tear Down Videos and Technical Electronics How-To's

  • Products / Components
    • Analog ICs
    • Connectors
    • Microcontrollers
    • Power Electronics
    • Sensors
    • Test and Measurement
    • Wire / Cable
  • Applications
    • Automotive/Transportation
    • Industrial
    • IoT
    • Medical
    • Telecommunications
    • Wearables
    • Wireless
  • Resources
    • DesignFast
    • Digital Issues
    • Engineering Week
    • Oscilloscope Product Finder
    • Podcasts
    • Webinars / Digital Events
    • White Papers
    • Women in Engineering
  • Videos
    • Teschler’s Teardown Videos
    • EE Videos and Interviews
  • Learning Center
    • EE Classrooms
    • Design Guides
      • WiFi & the IOT Design Guide
      • Microcontrollers Design Guide
      • State of the Art Inductors Design Guide
    • FAQs
    • Ebooks / Tech Tips
  • EE Forums
    • EDABoard.com
    • Electro-Tech-Online.com
  • 5G

USB 3.0 Promoter Group announces USB 3.2 Update

July 31, 2017 By Mary Gannon Leave a Comment

The USB 3.0 Promoter Group last week announced the pending release of the USB 3.2 specification, an incremental update that defines multi-lane operation for new USB 3.2 hosts and devices. USB Developer Days 2017 will include detailed technical training covering USB 3.2, fast charging advancements in USB Power Delivery, and other exciting topics.

While USB hosts and devices were originally designed as single-lane solutions, USB Type-C cables were designed to support multi-lane operation to ensure a path for scalable performance. New USB 3.2 hosts and devices can now be designed as multi-lane solutions, allowing for up to two lanes of 5 Gbps or two lanes of 10 Gbps operation. This enables platform developers to continue advancing USB products to fit their customers’ needs by effectively doubling the performance across existing cables. For example, a USB 3.2 host connected to a USB 3.2 storage device will now be capable of realizing over 2 GB/sec data transfer performance over an existing USB Type-C cable that is certified for SuperSpeed USB 10 Gbps.

“When we introduced USB Type-C to the market, we intended to assure that USB Type-C cables and connectors certified for SuperSpeed USB or SuperSpeed USB 10 Gbps would, as produced, support higher performance USB as newer generations of USB 3.0 were developed,” said Brad Saunders, USB 3.0 Promoter Group Chairman. “The USB 3.2 update delivers the next level of performance.”

“With increased performance and seamless compatibility, the new USB 3.2 specification brings even more speed and bandwidth benefits to new USB 3.2 devices, while remaining compatible with USB 3.0 and earlier devices,” said Roanne Sones, General Manager, Strategy and Ecosystem for Windows and Devices, Microsoft. “We’re excited to work with our partners in the USB 3.0 Promoter Group to help showcase these benefits to users around the world.”

Key characteristics of the USB 3.2 solution include:

  • Two-lane operation using existing USB Type-C cables
  • Continued use of existing SuperSpeed USB physical layer data rates and encoding techniques
  • Minor update to hub specification to address increased performance and assure seamless transitions between single and two-lane operation

For users to obtain the full benefit of this performance increase, a new USB 3.2 host must be used with a new USB 3.2 device and the appropriate certified USB Type-C cable. This update is part of the USB performance roadmap and is specifically targeted to developers at this time. Branding and marketing guidelines will be established after the final specification is published. The USB 3.2 specification is now in a final draft review phase with a planned formal release in time for the USB Developer Days North America event in September 2017.

The USB 3.0 Promoter Group, comprised of Apple Inc., Hewlett-Packard Inc., Intel, Microsoft, Renesas Electronics, ST Microelectronics, and Texas Instruments, continues to develop the USB 3.x family of specifications to meet the market needs for increased functionality and performance in SuperSpeed USB solutions. Additionally, the USB 3.0 Promoter Group develops specification addendums (USB Power Delivery, USB Type-C, and others) to extend or adapt its specifications to support more platform types or use cases where adopting USB 3.x technology will be beneficial in delivering a more ubiquitous, richer user experience.

The non-profit USB Implementers Forum, Inc. was formed to provide a support organization and forum for the advancement and adoption of USB technology as defined in the USB specifications. The USB-IF facilitates the development of high-quality compatible USB devices through its logo and compliance program, and promotes the benefits of USB and the quality of products that have passed compliance testing.

USB-IF
www.usb.org

DesignFast Banner version: 03eceadf

Filed Under: Uncategorized

Reader Interactions

Leave a Reply Cancel reply

You must be logged in to post a comment.

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Primary Sidebar

EE Training Center Classrooms

EE Classrooms

Featured Resources

  • EE World Online Learning Center
  • CUI Devices – CUI Insights Blog
  • EE Classroom: Power Delivery
  • EE Classroom: Building Automation
  • EE Classroom: Aerospace & Defense
  • EE Classroom: Grid Infrastructure
Search Millions of Parts from Thousands of Suppliers.

Search Now!
design fast globle

R&D World Podcasts

R&D 100 Episode 7
See More >

Current Digital Issue

April 2022 Special Edition: Internet of Things Handbook

How to turn off a smart meter the hard way Potential cyber attacks have a lot of people worried thanks to the recent conflict in Ukraine. So it might be appropriate to review what happened when cybersecurity fi rm FireEye’s Mandiant team demonstrated how to infiltrate the network of a North American utility. During this…

Digital Edition Back Issues

Sponsored Content

Positioning in 5G NR – A look at the technology and related test aspects

Radar, NFC, UV Sensors, and Weather Kits are Some of the New RAKwireless Products for IoT

5G Connectors: Enabling the global 5G vision

Control EMI with I-PEX ZenShield™ Connectors

Speed-up time-to-tapeout with the Aprisa digital place-and-route system and Solido Characterization Suite

Siemens Analogue IC Design Simulation Flow

More Sponsored Content >>

RSS Current EDABoard.com discussions

  • Smallest header needed to support PCB vertically above main PCB
  • What base emitter resistors are inside Darlington
  • Simulation of resonator in HFSS
  • series connection of power audio amplifier
  • Sampling with MOS transistor and cap

RSS Current Electro-Tech-Online.com Discussions

  • software PWM
  • ASM - Enhanced 16F and long calls - how?
  • Ampro 16mm Stylist projector woes.
  • Will Header and socket hold this PCB OK?
  • Passthrough charging-simple but impossible to achieve?

Oscilloscopes Product Finder

Footer

EE World Online

EE WORLD ONLINE NETWORK

  • 5G Technology World
  • Analog IC Tips
  • Battery Power Tips
  • Connector Tips
  • DesignFast
  • EDABoard Forums
  • Electro-Tech-Online Forums
  • Engineer's Garage
  • Microcontroller Tips
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips
  • Wire & Cable Tips

EE WORLD ONLINE

  • Subscribe to our newsletter
  • Lee's teardown videos
  • Advertise with us
  • Contact us
  • About Us
Follow us on TwitterAdd us on FacebookConnect with us on LinkedIn Follow us on YouTube Add us on Instagram

Copyright © 2022 · WTWH Media LLC and its licensors. All rights reserved.
The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media.

Privacy Policy