Hirose has expanded its BK19 Series hybrid FPC-to-board connector family with a narrow-width, ultra-low-profile version for portable devices. The connector has a 0.3 mm pitch, 0.5 mm stacking height and 1.2 mm width and combines power and signal contacts in a fully armored design that helps protect against housing damage during mating and drop impacts. Applications include compact medical devices, smartphones, wearable devices and VR/AR glasses.