By Timothy Hegarty, Applications Engineer, Texas Instruments This article compares electromagnetic compatibility (EMC) requirements in automotive, industrial and defense product family standards, specifically various test parameters, test equipment, test setups and test methods for radiated emissions (REs). Much like the treatment of conducted emissions [1] in part 1 of this two-part article series, the […]
Analog IC Tips
Front-haul ICs drive 50 Gbps PAM4 5G wireless optical modules
Semtech Corporation announced sampling of the newest member of its Tri-Edge CDR portfolio, the GN2256. Integrating Semtech’s proven Tri-Edge CDR platform with a differential EML (Externally Modulated Laser) driver, the GN2256 is the industry’s first such IC solution to enable 50Gbps PAM4 Fixed-WDM (Wavelength Division Multiplexing), Tunable WDM and Silicon Photonics optical modules. As with all […]
Evaluation kit simplifies design of battery-powered, smart-home products
Aspinity announced the availability of its Acoustic Event Detection Kit (EVK1) for battery-operated, smart home devices that are always listening for acoustic triggers such as window glass breaks, voice, or other acoustic events—delivering the essential technology that helps keep homes and families safe and secure. Featuring the company’s analogML core—a fully analog machine learning processor […]
HIgh-frequency, high-bandwidth RFICs and MMICs target RF and microwave
CML Microcircuits has announced the SµRF, a new range of high frequency, high bandwidth RFICS and MMICs targeting RF and mmWave applications. As wireless communications move further into the GHz range, the need for high-quality RF building blocks to enable high bandwidth and low latency is growing rapidly. The global demand for faster downloads and […]
Keeping the noise down
Compact nanocrystalline single-phase filters that suppress electromagnetic interference from the power provide engineers with greater design flexibility. In our increasingly connected world, we are ever more dependent on electronic equipment and devices and the semiconductors contained within. It is perhaps no surprise, then, to find that demand for components that can manage electromagnetic interference (EMI) […]
Software accelerates design-to-manufacturing handoff for PCBs
PCBflow is an innovative cloud-based software solution which bridges the gap between the electronics design and manufacturing ecosystems. PCBflow extends Siemens’ Xcelerator portfolio with a secure environment for printed circuit board (PCB) design teams to interact with a variety of manufacturers, and by rapidly performing a range of design-for-manufacturing (DFM) analyses in the context of […]
A comparison of EMI test setups and specifications for automotive, industrial and defense applications, part 1: conducted emissions
by Timothy Hegarty, Applications Engineer, Texas Instruments This article compares electromagnetic interference (EMI) requirements in automotive, industrial, and defense product family standards, specifically various test parameters, test equipment, test setups, and test methods [1-4] for conducted emissions (CEs). The comparison includes widely used dedicated standards in each industry: Comité International Spécial des Perturbations Radioélectriques (CISPR) […]
Clamshell spring-pin socket handles Intel FBGA packages
A new BGA socket addresses high-performance requirements for FineLine Ball grid Array packages. The CBT-BGA-6111 socket has a contactor that is a stamped-spring pin with a 19-gm actuation force per ball and a cycle life of 125,000 insertions. The self inductance of the contactor is 0.93 nH, insertion loss is less than 1 dB at […]
Automotive conductive polymer chip capacitors span 10–470 μF, 2.5–50 V
AVX Corporation has both expanded and improved upon its AEC-Q200-qualified TCQ Series Automotive Conductive Polymer Chip Capacitors, which have been field-proven in a wide range of demanding automotive, industrial, and telecommunications applications with limited board space and challenging operating environments since 2015. The series now offers two new case sizes for a total of five, several […]
Ultraminiature multilayer ceramic chip inductors work up to 10 GHz
AVX Corporation released a new series of ultraminiature multilayer ceramic chip inductors for high-frequency RF applications. The new LCCI Series inductors are currently available in three standard EIA chip sizes — 0201, 0402, and 0603 — with tight-tolerance physical dimensions almost exclusively in the submillimeter range and tin-plated surface-mount terminations, enabling compatibility with high-density PCBs […]
