Mentor, a Siemens business, announced significant advances in the Analog FastSPICE Platform with the introduction of Analog FastSPICE eXTreme technology for nanometer-scale verification of large, post-layout analog designs. Analog FastSPICE eXTreme includes revolutionary technology that can substantially boost simulation performance, while helping maintain the foundry-certified accuracy required for nanometer-scale analog verification. Analog FastSPICE eXTreme is especially […]
MEMs design automation platform includes enhanced modeling capabilities
Coventor, a Lam Research Company, announced the immediate availability of CoventorMP 1.3 – the newest version of its MEMS design automation platform. With added MEMS+ features, performance improvements, and new capabilities, CoventorMP 1.3 addresses the need to quickly and easily design highly complex MEMS devices and improve the performance and reliability of next-generation MEMS devices in […]
Extreme temperature sockets facilitate testing 216-lead quad flat pack devices
A new Stamped spring pin socket addresses high-performance requirements for testing 216-lead Quad flat packs – CBT-QFE-3021. The contactor used in the CBT-QFE-3021 socket is a stamped-spring pin with 14-g actuation force per lead and cycle life of 125,000+ insertions. The self inductance of the contactor is 0.88 nH, insertion loss is < 1 dB […]
Class D audio, Gallium-Nitride versus Silicon – Virtual Roundtable (part 2 of 2)
In this second part of EEWorld’s “virtual roundtable” discussion on Class D audio, our panelists delve into the impact that the emergence of gallium-nitride (GaN) is having on Class D designs: Where are silicon devices still dominant? What are the performance benefits of using GaN in Class D amplifiers? And what are the anticipated future […]
Class D audio technology and applications – Virtual Roundtable (part 1 of 2)
The first part of EEWorld’s two-part “virtual roundtable” discussion on Class D audio considers technical challenges and design trade-offs for engineers using Class D audio technology. Joining us for this virtual roundtable are: Joshua LeMaire (JL), Audio Systems Architect at Analog Devices; Steve Colino (SC), Vice President Strategic Technical Sales with Efficient Power Conversion; and […]
RF/Microwave bandpass filter implementations, Part 3: Microstrip, Coaxial, and helical filters
Part 2 looked at two types of RF/microwave filters, but there are many more, including ceramic coaxial filters and helical filters. They are discussed in this part. Microstrip filters Microstrip filters are built as a carefully defined pattern on a PC board. There is almost no limit to the filter designs which can be built […]
52-GHz-bandwidth sockets handle Kyocera optical QFN packages
A new high-performance low-profile elastomer socket handles 0.5-mm-pitch QFN packages. The SG25-QFN-2017 socket is designed for a 4×4-mm package size and operates at bandwidths up to 52 GHz with less than 1 dB of insertion loss (GSSG configuration). The contact resistance is typically 20 mΩ/pin. Network analyzer reflection measurements for the G-S-S-G case were taken […]
The single-chip loudspeaker: First fully MEMS-based speakers target earphone apps
What is billed as the world’s first monolithic true MEMS speaker is just one millimeter thick and is said to deliver high fidelity, full-bandwidth sound and low total harmonic distortion (THD) for sealed in-ear personal audio devices, including true wireless stereo (TWS) earbuds. Called Montara by its creator xMEMS Labs in Los Altos, Calif., the […]
RF/Microwave bandpass filter implementations, Part 2: Cavity and comb filters
The well-known and extensively analyzed lumped-element bandpass filter is generally not suitable for the RF/microwave region, but there are many distributed-element, energy-based alternatives. Part 1 of this article established the context for these RF/microwave filters, which operate in the spectrum from several hundred MHz and higher, and increasingly cannot use discrete lumped-circuit elements (RLCs). Instead, […]
RF/Microwave bandpass filter implementations, Part 1: Distributed filters
The well-known and extensively analyzed lumped-element bandpass filter is generally not suitable for the RF/microwave region, but there are many distributed-element, energy-based alternatives. Just say the word “filters,” and for many engineers, the mention of this topic stirs a mix of feelings ranging from fear to relief. Why fear? Because filters as a topic in […]
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