Analog IC Tips Archives | Electrical Engineering News and Products

Socket handles 625-pin BGA625 package without significant performance loss

February 6, 2020 By Lee Teschler

A new high-performance BGA socket for 0.65-mm pitch BGA 625 pin devices called the CG-BGA-5032 is designed for the 16×16-mm package size and operates at bandwidths up to 30 GHz with less than 1 dB of insertion loss. The socket is designed with an easy-open double latch clamshell lid with an integrated compression mechanism. The […]

The ABCs of functional verification techniques

January 31, 2020 By Aimee Kalnoskas

By Aijaz Fatima of Mentor, a Siemens business Functional verification is the process of demonstrating the functional correctness of a design with respect to the design specifications. Functional verification does not confirm the correctness of the design specification and assumes that the design specification is correct. It is one of the most challenging steps of […]

Flip-type MLCCs target automotive apps

January 30, 2020 By Aimee Kalnoskas

TDK has developed the new CGAE series, the world’s first flip-type MLCCs in 0510 design (EIA 0204) with capacitances of up to 1 µF, for automotive applications. Depending on their capacitance, the capacitors are designed for rated voltages of between 4 V and 50 V and they cover a capacitance range from 47 nF to […]

E-commerce site offers designers device models on demand

January 20, 2020 By Aimee Kalnoskas

MoDeCH Inc. launched its English language ecommerce site, “Model On! Search.” Previously available only in Japan, Model On! was developed over the past 15 years based on various proprietary modeling technologies for analog, high speed digital, and power electronics markets. “With Model On! Search, access to design and simulation models is now a one-stop shop […]

LPDDR5 socket boasts same footprint as the IC it holds

January 17, 2020 By Lee Teschler

New Grypper/G40 test sockets, part number 109111-0003, for the latest LPDDR5 memory devices allow testing of the newest generation of Package-On-Package type LPDDR5 devices that have 496 Ball 0.4-mm pitch, with speeds up to 5500 Mb/sec. The LPDDR5 Grypper/G40 socket fits to the same location/PCB footprint as the device allowing development and failure analysis. This […]

MIPI I3C v1.1 utility and control bus strengthens upgrade path implementations

January 16, 2020 By Aimee Kalnoskas

The MIPI Alliance announced MIPI I3C v1.1, the first update to its innovative interface that eliminates the historical pain points of I2C development. MIPI I3C v1.1, available now to MIPI members, is a scalable, medium-speed, utility and control bus that connects peripherals to an application processor, streamlining integration and improving cost efficiencies in the development of smartphones, wearables, high-performance […]

Pulse Density Modulation microphone features super-wide dynamic range

January 9, 2020 By Aimee Kalnoskas

TDK announces the T5818 Pulse Density Modulation (PDM) microphone with a dynamic range of 107dB at 590µA, the widest dynamic range in the industry at the lowest power. This allows for excellent acoustic performance in environments that shift from very quiet to very loud, such as far-field voice pickup barge-in for Smart Speaker applications. The T5818 microphone features 66dBA SNR, 135dB […]

Localization chip integrates triple-band RTK/GNSS receiver and triple-redundant inertial sensor

January 7, 2020 By Aimee Kalnoskas

Acienna announced the availability of the new ACEINNA OpenRTK330L, a low cost, state-of-the-art, high-performance triple-band RTK/GNSS receiver with built-in triple-redundant inertial sensors. Designed to replace the expensive and bulky precision RTK/INS systems used in today’s autonomous systems, this compact navigation solution meets the challenging performance, reliability and cost requirements of the automotive market along with […]

Analog Top Talks in December 2019 on EDABoard.com

January 2, 2020 By Aimee Kalnoskas

Peer-to-peer, engineer-to-engineer questions and answers from the EDABoard.com engineering community around analog ICs and analog design. Click the “Read more” link and follow the entire conversation and maybe add your two cents by logging in to EDAboard.com. Capacitor as a MOSFET in RC circuit – I have a resistor-capacitor circuit that I fitted with a […]

Open top socket for QFP48 packages

January 2, 2020 By Lee Teschler

A new stamped-spring-pin socket addresses high-performance requirements for testing 48-lead Quad flat pack chip packages. The contactor used in the CBT-QFE-3018 socket is a stamped-spring pin with 17-gm actuation force/ball and a cycle life of 10,000+ insertions. The self-inductance of the contactor is 0.88 nH, insertion loss is below 1 dB at 31.7 GHz, and […]