Heilind Electronics has expanded its antenna portfolio to include CXL Series omnidirectional base station antennas. The antennas are offered in various models to include lightweight, medium-duty, heavy-duty, ATEX-certified, and marine applications. The antennas’ lightweight design and low wind load reduce the static strength demands required for the antenna mast, while their sturdy build allows optimal […]
Analog IC Tips
Input bias current cancellation in bipolar op amps
Bipolar operational amplifiers have an essential input bias current requirement. This bias current has to come from somewhere and can be a nuisance in some types of high impedance circuits such as charge amplifiers and transimpedance amplifiers and can result in offset voltages where input resistances aren’t matched. The example shown below has an input […]
When inductors self resonate
Inductors only behave like inductors below because of what’s called their self resonant frequency. And the self resonant frequency arises because the equivalent circuit of real-world inductors aren’t strictly inductive. There are parasitic elements that come into play. To understand why, look at the equivalent circuit for an inductor. An inductor can be comprised of […]
4-channel, ESD device for high-speed interfaces protects automotive and video link applications
Nexperia has announced a new range of ESD protection devices aimed specifically at protecting the ever-increasing number of high-speed interfaces found in automotive applications, especially the in-vehicle networks (IVN) associated with infotainment and vehicle communications. As data rates increase and vehicles feature more electric content, the need for EMC protection becomes more critical, and providing […]
Unified, circuit simulation workflow incorporates fast SPICE engines to accelerate hyper-convergent designs
Today’s hyper-convergent SoCs consist of larger and faster-embedded memories, analog front-end devices, and complex I/O circuits that communicate at 100Gb+ data rates with the DRAM stack connected on the same piece of silicon in a system-in-package design. These challenges associated with verifying these complex designs scale as advanced technology process nodes present increased parasitics, process […]
Clound platform connects PCB design users with software, suppliers
Nexar is a cloud-based partner platform designed to connect the rapidly growing community of Altium 365 PCB design users and their companies with the software, suppliers, and manufacturers needed to transform ideas into smart & connected products. Electronics industry researchers estimate there are 31 billion internet-connected devices in the world today, with consumer demand growing […]
New 32-bit D/A converter designed for high-fidelity audio
ROHM Semiconductor announced the new BD34301EKV, a 32bit D/A converter IC designed for high fidelity audio equipment, capable of high-resolution playback of audio sources. ROHM also offers BD34301EKV-EVK-001 evaluation boards for testing the new IC’s performance (available via distributor channels). Designed to maximally extract and convert high-resolution audio data to analog, audio DAC chips are one of […]
Thick-film chip resistor arrays comply with AEC-Q200 standard
Bourns, Inc. announced several new AEC-Q200 compliant thick film chip resistor array model families. Bourns designed the new surface-mount model CATxxA-LF, CAYxxA-LF, and CAYxxA-AS series to help increase available board space and reduce costs. Offering long-life protection against many sulfurous environments, the Model CAYxxA-AS series is the first chip arrays from Bourns that meet both the AEC-Q200 […]
Interference suppression caps operate to 125 °C
TDK Corporation presents a new series of EPCOS MKP-X2 capacitors for interference suppression. In contrast to conventional models, which are designed for a maximum operating temperature of 110 °C, the new capacitors offer a maximum permissible operating temperature of 125 °C. The capacitance range of the B3292*P series ranges from 0.033 µF to 5.6 µF, […]
A comparison of EMI test setups and specifications for automotive, industrial and defense applications, part 2: Radiated emissions
By Timothy Hegarty, Applications Engineer, Texas Instruments This article compares electromagnetic compatibility (EMC) requirements in automotive, industrial and defense product family standards, specifically various test parameters, test equipment, test setups and test methods for radiated emissions (REs). Much like the treatment of conducted emissions [1] in part 1 of this two-part article series, the […]
