5G and AIoT need more speed and more capacity, and PCIe 4.0 delivers, doubling the speed of PCIe 3.0 and providing the much-needed performance boost to keep pace with innovation and industry trends. Not only speed and capacity, but tolerance of wide-range temperature is also crucial. Consumer-grade products aren’t tough enough to withstand the high […]
Industrial
Dual-band WiFi antennas optimized for 2.4GHz and 5GHz applications
AVX Corporation released a new series of IP67-rated, external, dual-band Wi-Fi antennas optimized for 2.4GHz and 5GHz applications. The new X9001748 Series external, dual-band Wi-Fi antennas have a standardized, ready-to-use, RoHS-compliant design with IP67 sealing for reliable outdoor operation and provide high-gain, high-efficiency, and high-reliability performance in low- and high-band applications with a variety of device configurations and […]
Mission computer sports 6th gen Intel atom MCU for deterministic Ethernet networking
Curtiss-Wright’s Defense Solutions has introduced a new ultra-rugged miniature mission computer that combines a low-power, quad-core 6th gen Intel Atom x6400E Series (Elkhart Lake) processor with support for real-time 802.1-based Time-Sensitive Networking (TSN) network connectivity. The ultra-small form factor (USFF) Parvus DuraCOR 313 mission computer is one of the industry’s first solutions for deploying a MIL-grade […]
Tiny, 0.8 mm-pitch board-to-board connectors target high-density industrial systems
Harwin announces the Archer .8 series. With a 5mm stack height, these dual-row 0.8mm-pitch board-to-board connectors are intended for uses where there is very limited available space and cost-effectiveness is equally important. These include factory automation and environmental monitoring equipment, smart meters, point-of-sales units, servers/data center hardware, and battery management systems in electric vehicles. The […]
New 13.3-in TFT display module features FHD resolution, 16:9 aspect ratio, IPS technology
Display solutions and Review Display Systems Inc. (RDS) has announced the introduction of a new 13.3-inch TFT display module from industrial display manufacturer Tianma. The P-series P1330FHF1MA00 features Full HD (FHD) resolution (1920 x 1080 pixels), a wide 16:9 aspect ratio, and in-plane switching (IPS) technology which provides excellent optical performance. Tianma P-series (Professional series) […]
Circular connectors ensure equipment productivity in harsh conditions
Dinkle International announces availability of its circular connector portfolio, providing dependable connectivity options to ensure increased equipment productivity, even in the most challenging conditions. Products are available in M12 and M8 sizes with a variety of pin arrangements, each following standard coding protocols to facilitate integration with industrial control systems, sensors, and actuators of all […]
36-to-12-V converter modules come in SIP-3 packages
The range of MagI³C-FDSM power modules with 36 V input voltage from Würth Electronik has been expanded to include a version with 12 V output voltage. The power module in a SIP-3 package represents a cost-effective solution to meet the requirements for the real-world voltage transients of a 24 V industrial power architecture. The new […]
Isolation transformers come in low-profile packages
Bourns, Inc. introduced its Model PAD00x-T764 Isolation Transformer Series. These transformers feature functional isolation and a low 0.4 mm profile form factor to simplify isolated power and serial communication signal integrity in CAN, RS-485, RS-422, RS-232, SPI, I2C, and lower power LAN-based applications. The Model PAD00x-T763 Series is ideal for industrial automation, embedded solutions, AC motor drives, […]
Single-axis linear stepper stages integrates linear encoder
The LSS-031-04-011-MEA is a revolutionary new series of single-axis linear stepper stages that integrates a linear encoder into the single-axis linear stepper motor stage to operate the linear stepper motor as a 2-phase brushless linear motor when coupled with an advanced motion control electronics package provided by H2W. When operated this way, the motors will […]
5G and AIoT will need new semiconductor materials
Technologies such as gate all around FETs and neuromorphic analog memory will increase speed and reduce power consumption in the chiplets that control artificial intelligence of things devices and systems. While 5G provides improved speed to consumers, it’s the industrial, automotive, infrastructure, and IoT applications that make 5G stand out. These applications will need IoT…
