Leland Teschler • Executive editor Officials estimate it will cost $50 billion to field the chargers needed for the expected number of electric vehicles on U.S. roads by 2030. But it’s possible that spending every penny of this amount won’t prevent the extinction of the cross-country road trip. Here’s the logic behind that statement: It’s […]
Power Electronic Tips
Form-in-place thermal gap filler contains no silicone
SARCON SPG-25B-NS from Fujipoly is an easy to dispense, low-viscosity, silicone-free compound that exhibits a thermal conductivity of 2.5 W/m°K and a thermal resistance of only 2.1°K•cm2/W. When applied between heat-generating components and a nearby heat sink or spreader, the form stable thermal material completely fills delicate gaps as small as 0.5 mm. This allows […]
Flyback LED controllers for LEDs supporting flicker-free dimming
Cost-effective dimmable and intelligent LED systems are expected to increase the market share disproportionately in the coming years. Introducing the ICL8800, ICL8810, and ICL8820 single-stage flyback LED controllers for constant output voltages, Infineon Technologies AG addresses the need of LED driver manufacturers in this regard. With their unique features, the ICs meet the necessary performance requirements for LED lighting applications, such as LED […]
Power IC hosts 650-V GaN FET, integrated driver
Tagore Technology announces the introduction of the TP44200NM 650V Gallium Nitride Power FET with an integrated driver IC in a compact 22 pin, 5mm x 7mm QFN package. The new device offers low RDS(ON) of 180mOhm and fast switching to deliver a highly efficient, low-cost power solution in a small footprint for a variety of […]
High-current/low-inductance power inductors handle automotive apps
TDK Corporation developed new HPL505032F1 power inductors for use in automotive circuits. The inductors enable level 5 ADAS applications for cameras by offering high-current and low-inductance for power circuits in central processing units and graphic processing units, such as advanced driver-assistance systems (ADAS). The new products achieve high power efficiency by adopting a low-resistance frame […]
Fast recovery epitaxial diodes feature low reverse leakage/reverse recovery charge
Taiwan Semiconductor announces the availability of the PU1xMx / PU2xMx families of fast recovery epitaxial diodes. This high-reliability (AEC-Q101 qualified) FREDs offer optimized switching speed vs. reverse recovery time. Their soft reverse recovery results in lower noise switching while achieving low losses and increased efficiency. The Micro SMA package heat spreader contacts provide excellent heat […]
IGBTs incorporate 650-V SiC Schottky barrier diode
ROHM Semiconductor announced the RGWxx65C series of hybrid IGBTs with an integrated 650V SiC Schottky barrier diode. The devices, qualified under the AEC-Q101 automotive reliability standard, are ideal for automotive and industrial applications that handle high power, such as photovoltaic power conditioners, onboard chargers, and DC/DC converters used in electric and electrified vehicles (xEVs). The RGWxx65C […]
LDMOS power transistors optimized for RF power amplifiers
STMicroelectronics is adding a broad range of new devices to the STPOWER family of LDMOS transistors, which comprises three different product series optimized for RF power amplifiers (PAs) in a variety of commercial and industrial applications. Featuring high efficiency and low thermal resistance and packaged to handle high RF power, STPOWER LDMOS devices combine a […]
DC link capacitors excel at handling humidity, vibration, and thermal cycles
The CDE BLH series of dc Link capacitors have been designed and tested to exceed the industry’s most stringent requirements for high humidity, vibration testing and thermal cycling. The Temperature, Humidity at Bias (THB) test exposes parts to the harsh conditions of 85°C at 85% relative humidity with rated voltage applied. This demanding test simulates […]
Distributed power architectures and distributed power control
Distributed power architectures (DPAs) are many and varied. DPAs, including the dynamic bus architecture and the intermediate bus architecture, are evolving as a result of new power demands from FPGAs, CPUs, GPUs, ASICs. And the concept of a DPA has extended into distributed power control architectures (DPCAs) being developed for electric vehicle charging stations, renewable […]
