Ironwood Electronics has introduced a 70-GHz elastomer socket designed for 37.5 × 37.5-mm BGA packages with a 0.65-mm pitch.
The socket is specified to support up to 28 W of power dissipation and is intended to provide performance comparable to a direct-soldered connection while allowing devices to be socketed on an application board. Its design incorporates a heat sink and fan to help manage thermal loads during operation.
A swivel lid with a quick-insertion mechanism is designed to simplify device changes, which may be useful in development, validation, and test applications requiring repeated IC swaps.
The socket supports high-speed applications up to 70 GHz while providing a removable interconnect option for compatible BGA devices.