By Rick Bye, Senior Product Marketing Manager, NXP Using face recognition for access control The COVID-19 pandemic highlights concerns over how many different surfaces we often touch during a typical day. For example, everyone entering a secured building, such as a workplace or after-hours hotel entrance, touches access control keypads that present an ideal surface […]
Bug Hunt! Spiraling in on formal coverage closure
By Ping Yeung Ph.D., Principal Engineer, Siemens EDA Many companies have used formal verification to verify complex SoCs [1][2] and safety-critical designs. Using formal verification to confirm design functionalities and uncover functional bugs is emerging as an efficient verification approach. Although formal verification will not handle the complexity of a design at the SoC level, […]
Sensors, sensors everywhere. Now what do I do?
By CEVA Mobile computing has driven an explosion in product opportunities – smartphones, wearables, hearables, sports cameras, and more. Sensing will further extend opportunities in applications which must be environment-aware. Now it’s commonplace to think about object recognition and collision warning through visual, radar, or Lidar sensing. Short-range proximity risk through ultrasonic sensors. Motion and […]
element 14 and Infineon partner for Low-Power IoT Design Challenge
The element14 Community, an Avnet Community, today introduced its Low Power IoT Design Challenge in partnership with Infineon Technologies. The challenge encourages element14 Community members to utilize Infineon Technology kits to build low-power IoT devices that enhance industrial design. There are several industrial design applications that can benefit from a lower power and easier to […]
GaN is cost-effective in motor drive applications
By Eric Persson, Senior Principal Engineer AC-DC Applications, Infineon Technologies We take motors for granted – they have been with us since Benjamin Franklin experimented with electrostatic types nearly three hundred years ago – but the days are long gone when they were controlled in a simple on/off way. Motors in today’s applications, from clothes […]
Increasing power conversion efficiency with new semiconductor technologies
There is a choice of devices to use, including SiC FETs, a hybrid of silicon and SiC technology. This article discusses characteristics of the devices in comparison with other approaches. High efficiency is the universal aim in the world […]
High current, high voltage silicon Schottkys offer low VF and IR
When a major defense contractor needed a high-performance diode for their next-generation high voltage power supply, SSDI expanded its Sedpack product line of hermetic, silicon Schottkys to meet their needs. SSDI’s proprietary Sedpack design consists of a eutectic die attach, which leads to better current carrying capabilities compared to devices using wire bonds. The high […]
Ruggedized storage is engineered for data-intensive automotive systems
Micron announced that it is sampling 128GB and 256GB densities of its 96-layer NAND as part of its new portfolio of UFS 3.1 managed NAND products for automotive applications. With infotainment systems evolving to include high-resolution displays and human-machine interface capabilities based on artificial intelligence (AI), Micron’s UFS 3.1 portfolio provides much-needed high-throughput and low-latency […]
SSDs built with 176-layer NAND
Micron announced volume delivery of its first PCIe Gen4 solid-state drives (SSDs) built with the world’s first 176-layer NAND. The company is also shipping the world’s first 1α node-based LPDDR4x DRAM this month. LPDDR4x is the latest JEDEC specification for fourth-generation low-power DRAM with improved input/output voltage for substantially lower power, making it ideal for […]
Precision RF connectors support 65 GHz applications
Samtec has released a family of SMPM products designed to support the demands of emerging technologies where space is limited and a high operating frequency up to 65 GHz is required. Samtec offers ganged, multi-port solutions in both cable-to-board and board-to-board applications. Standard SMPM connectors with bullet adaptors, and cable assemblies using .047″ and .086″ cable, are […]
