TE Connectivity (TE) introduced its new extra-large array (XLA) socket technology, which provides more reliable performance with 78 percent better warpage control than traditional molded socket technologies. The XLA socket technology allows TE to design enhanced sockets to support high data speeds in next-generation data centers.
The utilization of printed circuit board (PCB) substrates versus other plastic materials results in minimal warpage and enables TE to design the industry’s largest one-piece socket with sizes up to 110mm x 110mm and a 10,000+ position count capability. Because of such large capacity, these sockets are capable of extremely fast data rates up to 56Gbps.
“TE’s XLA socket technology provides the ability to scale to extremely high pin counts, staying ahead of market demand for next-generation switches and servers,” says Erin Byrne, Vice President, Engineering and Chief Technical Officer for Data & Devices at TE Connectivity. “The XLA socket will enable the expansion in scale and performance needed for future high-performance computing and processing.”
XLA socket technology also offers 33 percent improved true position on the solder ball and contact, low coefficient of thermal expansion (CTE) mismatch to motherboard, and mitigates SMT risks during customer application. Two versions are available: the hybrid land grid array/ball grid array (LGA/BGA) and the dual compression LGA/BGA.