In a video interview with Wilson Lee of Tektronix, EE World shows how COVID-19 brought about remote learning, and with it, remote operation of lab equipment at universities.
5G
Measure power in complex RF signals
Antenna transmits, receives 915 MHz ISM and LoRaWAN signals
The Fera antenna from Antenova uses a flexible design that can fit into small spaces.
CMOS oscillators exhibit low phase noise
IQD is launching its newest low phase noise oscillators, the IQXO-408 & IQXO-455, available in industry-standard packages of 2.5 x 2.0 mm and 3.2 x 2.5 mm. The new CMOS clock oscillators can perform with a close-in phase noise as low as -113 dBc/Hz @ 10 Hz and far-out phase noise as low as -175 […]
Deploy and maintain an Open RAN network
Open radio access networks offer advantages in locating network functions of proprietary RANs. Automation and orchestration let telecom networks do what computing networks have done for years.
IMS2021: Live event was never in doubt
While the International Microwave Symposium will also hold a virtual conference, exhibitors insisted on a live event albeit with COVID-19 restrictions.
6G research: consensus grows
Several themes have begun to emerge in the 6G community, providing some clues as to what the next generation might bring.
Renesas enters the cellular module market
The RYZ014A module lets IoT device designers add 4G LTE Cat-M1 connectivity for low-speed data devices.
Differential switch routes high-frequency signals
The MM5600 DPDT switch from Menlo Micro routes signals to 20 GHz, 40 Gb/sec. 5G is one of the technologies driving the need for higher-speed digital and RF signals. Those signals, which often run over differential pairs through a PCB, typically need switching. MEMS switches offer fast switching speeds with low power and low signal…
200 μm vapor chamber claimed to be the world’s thinnest heat dissipator for electronic devices
Murata Manufacturing Co., Ltd. and Cooler Master Co., Ltd. have jointly developed a 200 μm vapor chamber, the world’s thinnest heat dissipator for electronic devices. This is the first product to result from the joint development partnership between Murata, which brings expertise in designing compact electronic components, and Cooler Master, a leader in heat dissipators […]
