Winbond Electronics Corporation announced a collaboration to combine HyperRAM and Apollo4 to deliver ultra-low-power system solutions for IoT endpoints and wearables. Several customers are in design with Ambiq’s Apollo4 SoC and Winbond 256Mbx8 HyperRAM Hybrid Sleep Mode (HSM), with volume production expected in 2022. HSM power consumption is about 50% if comparing to normal standby […]
Wearables
Haptics interface brings touch control to smartphone sides
The new NexusTouch sensing and localized haptic platform from Boréas Technologies allow designers to expand touch-based user interfaces on the sides of smartphones and gaming phones. The platform enables seamless context-sensitive swipes, taps, and clicks—all while delivering rich haptic feedback. Blending advanced gesture sensing with localized haptics, NexusTouch supports a range of new use cases, from finger-clicks that […]
Haptic platform allows context-sensitive swipes, taps, and clicks on smartphones, gaming phones
The new NexusTouch sensing and localized haptic platform from Boréas Technologies allows designers to expand touch-based user interfaces on the sides of smartphones and gaming phones. The platform enables seamless context-sensitive swipes, taps and clicks—all while delivering rich haptic feedback. Blending advanced gesture sensing with localized haptics, NexusTouch supports a range of new use cases, […]
How is human-powered wearable electronics progressing?
Researchers continue to search for improved solutions to power the many wireless, wearable sensing devices that are being developed to avoid frequent, or as frequent, charging and/or battery replacement. Two of the prominent research areas include thermoelectric generators (TEGs) and piezoelectric energy harvesters. With wearable thermoelectric generators (TEGs), the amount of thermo‐generated power strongly depends […]
Tiny high-power TVS diodes excel at ESD protection
TDK Corporation has released tiny high-power TVS diodes for ESD protection, extending its portfolio of components for bidirectional overvoltage protection of I/O interfaces. The space requirement of the so-called chip-scale package (CSP) is just 400 x 200 µm² (CSP01005) or 600 x 300 µm² (CSP0201), while the package height of just 100 µm is also […]
Haptic engine module manages piezo actuators in space-constrained applications
Boréas Technologies unveiled the Boréas Piezo Haptic Engine (Boréas PHE), the first module to harness the high performance of piezo actuators to solve wearable devices’ most significant challenge—achieving true high-definition (HD) haptic feedback in a broad range of low-power space-constrained devices. The Boréas PHE is a major advancement over the two legacy technologies that have dominated haptics in […]
SMT tactile switch designed for wearables and portable IoT devices
C&K has developed a miniature SMT tactile switch designed for wearable and portable IoT devices. The PTS847 Series side-actuated tact switch combines a space-saving design with heightened durability to handle drop-impacts common to consumer devices. At only 4.6 mm x 2.2 mm x 2.6 mm, the PTS847 Series features an edge mount configuration that raises […]
Why mid-band spectrum suits 5G
The 5G mid-band spectrum offers a compelling balance of capacity and coverage necessary for new applications and use cases.
Low-power cellular module combines MCU and modem
In conjunction with Sony Semiconductor Israel (Sony, formerly Altair Semiconductor), STMicroelectronics, and Truphone, Murata introduced the availability of the Type 1SE module, a highly integrated, miniaturized, low power cellular IoT solution featuring a low power STM32L4 MCU and an ALT1250 M1/NB modem. Measuring just 15.4 x 18.0 x 2.5 mm, it combines the key components […]
Hybrid FPC-to-board connector combines low-profile with high-current capacity
Hirose has developed a hybrid flexible printed circuit (FPC) to board connector that offers significant space savings and high power capability. The low-profile BK13C series has a pitch of only 0.35 mm, stacking height of 0.6 mm, and width of 1.9 mm, enabling OEMs to reduce the size and cost of portable and wearable electronic […]
