By Travis Amrine, Global Industry Marketing Manager, I-PEX In 2019, 5G started large commercial deployments globally. What led us to this transformative and evolutionary step in communication? 5G chipset makers, network equipment OEMs, standard bodies, and legions of companies who contributed to make 5G a reality. 5G has been in development for years from research…
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Control EMI with I-PEX ZenShield™ Connectors
By Nick Murata, Website and Marketing Project Manager, I-PEX ZenShield™ is the brand name for the I-PEX small connector series that includes high-performance EMI shielding design. As high-speed internet improves and the usage of large-capacity memory devices increases, high-resolution images and videos can be enjoyed more easily on consumer products such as PCs, tablets and […]
Speed-up time-to-tapeout with the Aprisa digital place-and-route system and Solido Characterization Suite
Today, advanced process node SoC designs continue to push the envelope of design and implementation complexity, as well as cell instance count. Competitive top-level power, performance and area specifications, coupled with aggressive production timelines, often result in challenging design closure cycles for next-generation SoCs. A major factor causing tremendous difficulty in design closure at advanced […]
Siemens Analogue IC Design Simulation Flow
This webinar will provide an overview of the Siemens analogue custom IC design simulation flow. Starting with S-Edit where the design is captured followed by the simulation set-up. In the simulation setup, the designer has choices of many different analysis types, sweeps and corners that are supported by Analog FastSPICE (AFS). After the simulation has […]
Fast Design Closure with Aprisa P&R
As semiconductor manufacturing technology continues to advance, the size and complexity of integrated-circuit designs grow exponentially. Consequently, the time-to-design-closure of an IC design project becomes not only prolonged, but also uncertain. The impact is especially pressing at digital place & route stage of the design process. One major factor causing this tremendous difficulty in design […]
What is the importance of resolution in an oscilloscope?
When looking at the oscilloscope feature of a multi-instrument device or when comparing two benchtop oscilloscopes, the first specifications that we look at are the bandwidth and sample rate. While these are incredibly important specs, often most design work is done well within the limits of most products and the more critical specification to consider is resolution. Did you know that while most […]
Using Linux on a Portable Oscilloscope (While Keeping Traditional USB Functionality)
Digilent’s New Analog Discovery Pro 3450 Opens Things Up for Engineers By Kaitlyn Franz, Test Product Manager As design requirements become increasingly more complex, engineers around the world are asked to shorten design cycle time and increase output. Flexible test equipment that can research, validate, and test is one of the ways engineers can speed […]
Introducing 3DPP Technology
Power conversion can often be the bane of product designers, regardless of what they are designing. In space-constrained applications such as cutting-edge IoT devices or handheld medical devices, using standard converter modules can be limited by space and discrete power conversion design can be costly and time-consuming. To help designers get their designs to market […]
The UKCA Mark – Selling Into the UK After Brexit
By Andrew Johnson, Director of Product Management The withdrawal of the UK from the European Union or “Brexit” has been a turbulent journey for both sides, concluding on December 31, 2020, with the end of the “transition period” during which negotiations have taken place on new mutual trading arrangements. One of the consequences of Brexit […]
Pushing the Boundaries of High Voltage GaN Power Conversion
10 kW Applications Gain High Efficiency Power Conversion from Highly Scaled GaN HEMTs 25% lower loss than SiC in the standard TO-247 package Authors: Carl Neufeld, Senior Member of Technical Staff & Manager, Transphorm Yifeng Wu, Senior Vice President of Engineering, Transphorm Numerous application markets from broad industrial and consumer electronics to the rapidly growing […]
