When connecting cable assemblies to PCBs, you need more than just a physical connection. These interfaces must meet specific industry standards to deliver minimal performance across different applications. Understanding the right standards for your project is necessary when applying to both consumer electronics and aerospace systems. This FAQ discusses the most common standards for the […]
FAQ
What are the different key layers of IoT architecture? part 2
This second part of the FAQ discusses the three upper layers of the IoT architecture, which extend beyond the physical and network layers. The middleware layer processes and manages raw IoT data from connected devices. The application layer provides user interfaces and visualization tools. The business layer converts technical capabilities into actionable business outcomes. Part […]
Why is understanding safe operating area (SOA) necessary for power electronics engineers?
Power semiconductor devices and batteries operate within specific safe operating areas (SOAs) to ensure reliability and longevity. This FAQ explains the progression from basic operating areas to electrical and thermal SOAs, culminating in the combined SOA. We will examine how these concepts apply to both semiconductor devices and batteries, with a practical case study of […]
What are the different types of wearable military connectors?
Many soldier-worn systems integrate advanced sensors and communications technologies into uniforms, helmets, and tactical vests. These technologies rely on rugged, lightweight connectors to link disparate systems, deliver power safely, and ensure reliable data transmission on the battlefield. This article explores the evolution of soldier-worn military technologies and the role of wearable connectors in enabling seamless […]
What are the different key layers of IoT architecture? part 1
A layered Internet of Things (IoT) architecture provides modularity, scalability, and flexibility, allowing each layer to focus on specific tasks and technologies. This FAQ series covers the five-layer IoT architecture and explains why it is a commonly used framework. This first part focuses on the first two layers. IoT Architecture provides a structured framework for […]
What is flip-chip technology in IC packaging?
Flip-chip technology is an advanced semiconductor packaging and assembly method that involves directly mounting the semiconductor chip onto a substrate or PCB with the circuitry facing downward. This FAQ will convey the basic idea of flip-chip technology and how it differs from conventional wire bonding technology. A simple view of the flip-chip technology A simplistic […]
Five challenges for developing next-generation ADAS and autonomous vehicles
ADAS and autonomous vehicles need new datacom architectures and new attitudes. The state of California requires autonomous vehicle manufacturers to annually document and report every manual intervention by test drivers, including the cause and the vehicle’s mileage. In less than five years, these reports have demonstrated significant improvements in miles per intervention for virtually every […]
Robust design for Variable Frequency Drives and starters
Variable Frequency Drives (VFDs) and soft starters are essential components in modern industrial and commercial systems. VFDs provide precise control over motor speed, torque, and efficiency, matching speed to load requirements to minimize energy consumption. Soft starters gradually increase motor voltage to limit inrush current and prevent damage to the electrical system. Controlled inrush current […]
What’s the difference between a VCSEL and PCSEL?
A vertical cavity surface-emitting laser (VCSEL) relies on a three-dimensional (3D) structure for light emission. A photonic crystal surface-emitting laser (PCSEL) incorporates a 2D photonic crystal (PhC) layer to manipulate light emission. Those structural differences lead to different performance and application possibilities. An obvious difference between the various types of semiconductor lasers is the beam…
What is the role of interconnects in continuous glucose monitors (CGMs)?
Continuous glucose monitors (CGMs) rely on precision electronic components — including specialized connectors and interconnects — to ensure accurate sensing, signal integrity, and reliable data transmission. This article reviews the core functionality of CGMs and highlights the key role of interconnects in these critical medical devices. It also explores how miniaturization drives next-generation CGM design, […]
