Generative artificial intelligence (AI) requires rapid and continuous movement of large amounts of data. In a growing number of instances, electrical input/output (I/O) connections between the ICs in chiplets are becoming a bottleneck to higher performance. Key electrical I/O performance barriers include power efficiency, bandwidth, and latency. This FAQ looks at the anticipated benefits of […]
FAQ
How can carbon nanotubes improve interconnect performance?
Carbon nanotubes (CNTs) have been proposed for reducing fretting wear in connectors used in high-vibration environments like vehicles. They can also be used to make contacts with lower contact resistance and higher corrosion resistance compared with silver (Ag) plating, and they have been used to reduce the weight in some shielded cables by 25% or […]
Delivering power supply reliability in mission-critical systems
There are several factors to consider when selecting a power supply that delivers the high voltages often needed by large and complex high-performance systems. For almost all electronic products and systems, high reliability should be expected. Still, in some markets, reliability cannot be compromised or a trade-off for other performance factors. In particular, mission-critical industrial […]
How Matter impacts sensors: part 1
With the support of connectivity companies such as Amazon, Apple, Google, Samsung Electronics, and more, the Connectivity Standards Alliance (CSA) announced the Matter standard in October 2022. The standard’s intent is to provide secure and easy to configure interconnected products for consumers. That type of interconnectivity is essential to smart homes. When Matter 1.2 was […]
How do UCIe and BoW interconnects support generative AI on chiplets?
The bunch-of-wires (BoW) and Universal Chiplet Interconnect Express (UCIe) standards provide designers with tradeoffs in terms of throughput, interconnect density, delay, and bump pitch. This FAQ compares the performance of BoW and UCIe and looks at how optical interconnects may provide a path to even higher performance interconnects in chiplets. To realize optimal performance for […]
How current sensing impacts electric vehicles: part 2
Part 1 of this blog addressed current shunts and Hall-effect sensor designs. This part discusses current transformers and new technology options such as magnetoresistance and even diamond quantum sensors. One of the major issues in today’s electric vehicles (EVs) is the ongoing evolution of technology with the standards evolving as well. In the 100+ years […]
What is the heterogeneous integration roadmap, and how does it support generative AI?
The heterogeneous integration roadmap (HIR) is an ongoing initiative of the IEEE Electronics Packaging Society. It’s a living document that continues to evolve and expand in response to technological developments like the growth of generative artificial intelligence (AI) and quantum computing. This FAQ starts with a brief overview of heterogeneous integration, looks at the scope […]
How current sensing impacts electric vehicles: part 1
The need to transition from gasoline and diesel (fossil fuels) powered vehicles to electric vehicles (EVs) to reduce carbon dioxide levels has revealed many controversial issues. Common issues include implementation timing, required infrastructure (including fast charging multi-vehicle systems), legislated rather than consumer-based adoption, ongoing system enhancements, and sources of new critical raw materials. One of […]
How to separate differential and common-mode harmonic noise currents
Differential-mode and common-mode currents can cause your product to produce radiated and conducted emissions. These three techniques can help you measure them.
How does the open domain-specific architecture relate to chiplets and generative AI?
The Open Domain-Specific Architecture (ODSA) is a project within the Open Compute Project (OCP) community to establish open physical and logical die-to-die (D2D) interfaces for chiplets. The goal is to democratize the design and use of chiplets for domain-specific high-performance computing (HPC) applications like generative artificial intelligence (AI). Domain-specific architectures (DSAs) are an emerging approach […]